Konferenzen  >  Informatik  >  Internet der Dinge (IoT) und Sensornetze

Hong Kong Printed Circuit Association (HKPCA)

Themed "AI Powers the Future", the International Electronic Circuit (Shenzhen) Exhibition is one of the most influential PCB and electronic assembly exhibitions in the world.

Visitor Inquiry;     Tel.: [(86-20) 3758-3765 ext. 8008];     Email: pr@hkpcashow.org

Printed Circuit Boards, Automotive, Electronics, Communication, Smart Automation, Electronic Assembly, AI, 5G, Semiconductors

Computerhardware,    Elektronik

Optica

This incubator meeting aims to bring together the telecom industry and the scientific community to explore the usage of the deployed telecommunication fiber networks as a large environmental sensor network, providing added value to the existing infrastructure and opening the doors for the accumulation of large datasets for scientists and the development of the next generation of disaster early warning network services.

Optoelektronik und Anzeigetechnik,    Mobilcomputing & Telekommunikation

Schloss Dagstuhl - Leibniz-Zentrum für Informatik GmbH

Reactive systems are software systems that engage in a continual dialogue with their environment. They constitute the software parts of cyber-physical systems where timely reactions are often critical to safety. Applications include autonomous vehicles, electric power systems, industrial automation, healthcare electronics, and robotics. Because the software engages in a continual dialog with its environment, it often has conflicting requirements. It needs to be predictable, but robust to unpredictable events; it needs to react in a timely manner, but this often requires reacting with inconsistent information; it needs to be adaptable, but demonstrably safe; and it needs to be secure, but accessible and available. Many conferences and workshops focus on one of the goals, such as achieving real-time behavior, without explicitly acknowledging the costs and without providing sound strategies for dealing with failures that prevent reaching the goals. The focus of this seminar will be on the tradeoffs that are intrinsic in the design of such systems. When you make a system predictable, available, secure, or even demonstrably safe, what have you lost? This Dagstuhl Seminar will pull in experts from manifold disciplines to identify and discuss the fundamental limits in reactive systems design that make tradeoffs inevitable.

Implementierung und Anwendungen von künstlicher Intelligenz,    Soft Computing, Evolutionäre Algorithmen, metaheuristische Optimierung, Fuzzylogik

Association Tunisienne de Technologie et du Développement Durable (ATTeDD)

ICCAD’25 will be held in May 7-9, 2025 in Istanbul, Turkey. Our conference is a forum for presenting excellent results and new challenges facing the field of the reliability and availability of Control, Automation and Diagnosis. It brings together experts from industry, governments and academia, experienced in engineering, design and research. This conference will provide a remarkable opportunity for the academic and industrial communities to address new challenges, share solutions and discuss future research directions. The technical program will include plenary lectures, regular technical sessions, and special sessions.

Secrétariat de ICCAD;     Tel.: [+216 28 402 104];     Email: contact@iccad-conf.com

Control, Automation, Diagnosis, AI, Robotics, Informatics, Comuter vision, Renewable energy, green transportation;

Systemtheorie, Regelung und Automatisierung,    Simulation

CZESND

It is co-sponsored by Sichuan Institute of Electronics and IEEE, technically co-sponsored by Chengdu Section, Chengdu Section AP/EMC Chapter, Chengdu Section SP Chapter, IEEE Chengdu Section SSC/CAS Joint Chapter, Sichuan Institute of Electronics, hosted by Youth Talent Work Committee of Sichuan Institute of Electronics, also with the support of University of Electronic Science and Technology of China, Sichuan University, Southwest Jiaotong University, Xi’an University of Technology, Singapore Institute of Electronics, Chengdu University of Technology, Chengdu University of Information Technology, etc.

Email: Nazal@sina.com

Antennas and Microwaves; Electronics Materials and Devices; Communication and Networks; Power and Electrical Engineering; Aerospace & Electronics Systems; Electronics Applications; Internet of Things; Embedded System; AI and Applications; Control and Robotics; Signal Processing;

Elektronik,    Elektrotechnik

MIPRO Croatian Society

The CTI conference is a traditional forum for scientists and practitioners in the merging area of telecommunications and information and communication technology. The conference is an opportunity for researchers, industry professionals, and academics interested to exchange experience and research results, and to discuss different aspects of emerging communication technology and approaches to solving identified challenges in this field. The scope of the conference is Information and Communication Technology (ICT) and its application in different domains.

Zeljka Car;     Tel.: [+38551423984];     Email: zeljka.car@fer.hr

Integration of Information and Telecommunication Systems, Interactions of ICT with Other Technologies, Research and Development of ICT Systems, Wireless and Wireline Communications, Optical Communications in Core and Access Networks, Satellite Communications; New Generations Networks, Unmanned Aerial Vehicles, 5G Mobile Network and Beyond - Theory, Practice, Predictions, Security, Control and Management in Communication Networks, Network Performances and Quality of Service; Dependability and Protocols, Network Modeling, Simulation, Security, and Energy Efficiency, Telecom Cognitive Technology, Information Security and Signal Processing, Enterprise Infrastructure and Applications, Internet of Things/Everything (IoT/IoE) and Smart Society Concept, Intelligent IoT (IIoT), ICT Solutions Based on Emerging Technologies (Virtual/Augmented/Mixed Reality), Holographic Communication, Machine Learning, Robotics, Accessibility and Assistive Technology; Technology for Inclusive Society, m-Health / e-Health / Ambient Assisted Living, Biomedical Applications of ICT, Social Influences and Responsibilities of ICTs, Human Factors in Service Personalization, Self-Service Platforms for End Users, Telecommunications for Industry 5.0

Mobilcomputing & Telekommunikation,    Netzwerke, Internet

ACMSC

2025 7th Blockchain and Internet of Things Conference (BIOTC 2025) aims to provide a forum for researchers, practitioners, and professionals from the industry, academia and government to discourse on research and development, professional practice in Blockchain and Internet of Things. BIOTC 2025 will be held in Tsukuba, Japan during June 25-27, 2025. Welcome scholars and researchers working in the field of Blockchain and Internet of Things from all over the world to attend the conference and share your experiences and lessons with other enthusiasts, and develop opportunities for cooperation.

Email: amychou2020@163.com

Blockchain for Internet of Things; Blockchain Fundamentals; Alternative proof of work algorithms; Blockchain for Banking and Finance; Blockchain for Supply Chain; Blockchain for Consumer Products and Retail; Blockchain for Automotive; Blockchain for Medicine and Health Care;

MDPI

We are delighted to invite you to this premier gathering of innovators, researchers, and experts at the forefront of sensors, sensing technology, AI sensors and AI-enhanced sensing systems, and transducers and AI-enhanced transducers. Building on the success of our previous conference in Singapore, this event promises to be an exciting platform for exploring cutting-edge advances and fostering collaboration in the rapidly evolving field of AI, Sensors, and Transducers. AI Sensors & Transducers 2025 expects to host over 600 participants from around the world.

Conference Secretariats;     Email: ais2025@mdpi.com

Sensing Systems Enhanced by AI, Computer Vision, AI Sensors Based on Vision and Voice Data, Data Fusion and Processing with Sensor Applications, Sensor Modality/Sensing System Enhanced by Multi-Modality Deep Learning, Data Mining for Sensor Applications, Edge Computing Technologies, Neuromorphic Computing, Computing in Memory, In Sensor Computing, MEMS Sensors Enhanced by Edge Computing, CMOS MEMS/NEMS and AI Sensors, Hardware for Enabling Artificial Intelligence of Things (AIoT) Systems, Heterogeneous Integration for AIoT Systems, Chiplet and System-in-Package (SiP) for AIoT-on-Chip, Autonomous AIoT Systems, Cutting-Edge AI Sensor Technologies, Generative AI Technologies, Photonics AI Accelerator, Innovative AI Sensor Applications Across Industries, Physical Sensors and MEMS, Chemical Sensors, Medical Sensors, Gas Sensors, Ultrasound Sensors, Optical Sensors, CMOS Image Sensors, and IR Focal Plane Array, Magnetic Sensors and Spintronics, Biosensors and Bioelectronics, Wearable Sensors, Implantable Sensors, Neural Interfaces and Electroceuticals, Sensors for Intelligent Robots, Sensors for Drones, Self-powered Sensors, Zero-biased Sensors and Science, Nanomaterials, Nanosensors and NEMS, Si Photonics (SiPh) for Sensing, Nanophotonics and metalenses for Sensing, Metasurface and Mid-IR Sensing, Metamaterials and THz Sensing, Spectroscopy and Sensing Technology, Internet of Things (IoT) and Sensor Networks, Energy Harvesting for IoT Sensors, Remote Sensors, Data Acquisition, and Processing, Integration of Actuators with Sensors for Smart Systems