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Optica

Join our online industry meeting on Photonic Integrated Circuits (PICs) packaging for volume manufacturing. This event gathers industry leaders to discuss transformations in PIC packaging to meet mass manufacturing demands, similar to CMOS microelectronics. We will explore strategies for high throughput and yield, essential in today's tech landscape. The meeting will tackle challenges in PIC assembly, such as precision alignment, thermal management, and co-packaging with electronic components. We will also discuss the shift towards wafer-level processes required for increased production volumes, encouraging collaboration and innovative solutions for mainstream volume PIC manufacturing.

Ingenieurwesen und Industrie (allgemein),    Computerhardware