Tagungen und Workshops zum Thema Elektronik

IEEE Electron Devices Technology and Manufacturing Conference (EDTM) is intended to serve as a forum for the electron devices community to collaborate on topics ranging from devices, materials, and tools, to create new and innovative technologies.

Tel.: [+81 3 5657 0777];     Email: edtm@jtbcom.co.jp

Devices and Manufacturing for

Ingenieurwesen,    Optoelektronik und Anzeigetechnik

INTELEC® is a global technical community dealing with the science and engineering of the energy and power systems needed to operate critical and high-availability information communications technology (ICT) networks and infrastructure.

Email: info@intelec2019.org

DC Power System, Thermal Management, Energy Management, Telecommunications Network, Renewable & Alternative Energy Resources

Phased array systems have made major steps forward with the development of many major radar and communications systems. Due to many recent advances, including MMIC, photonics, and digital beamforming, phased array systems and technology continue to progress rapidly. Current and future developments of ground -based, sea-based, airborne, and space -based phased array radar, communications, and other electronic systems will be discussed at this international symposium.

The international VDI Congress ELIV (Electronics In Vehicles) is THE event for all experts in the field of electrical and electronical car engineering and integration of mechanical and electronical systems.

The International Academy, Research and Industry Association (IARIA)

Part of NetWare 2019

Messtechnik,    Internet der Dinge (IoT) und Sensornetze

The International Academy, Research and Industry Association (IARIA)

Part of NetWare 2019

Messtechnik,    Internet der Dinge (IoT) und Sensornetze

The International Academy, Research and Industry Association (IARIA)

Part of NetWare 2019

BCICTS is the premier forum for developments in bipolar, BiCMOS, and compound semiconductor integrated circuits, devices, and technology. Coverage includes all aspects of the technology: materials, device fabrication, device phenomena, TCAD modeling, compact modeling, integrated circuit design, testing, and system applications. A wide range of integrated circuit technologies are covered, including bipolar, BiCMOS, SiGe, GaAs, GaN, InP, SiC, and CMOS. The latest results in wireless, analog, RF, microwave, high-speed digital, mixed signal, optoelectronic, millimeter wave, and THz integrated circuits are embraced.

International Test Conference, the cornerstone of TestWeek events, is the premier conference dedicated to the electronic test of devices, boards and systems – covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment designers, and test engineers

The International Microwave and Optoelectronics Conference was initiated in 1985, biennially, aiming at exchange and dissemination of scientific and technological knowledges. It is currently an event sponsored by the Brazilian Microwave and Optoelectronic Society (SBMO) and the IEEE Microwave Theory and Techniques Society (MTT-S). For the first time since its creation IMOC will leave the Brazilian territory and will be held in Portugal. The organization will be in charge of the Instituto de Telecomunicações / Universidade de Aveiro / Instituto Superior Técnico and the Federal University of Espírito Santo.

Advances and Challenges in Communication Technology

Elektrostatik, elektromagnetische Wellen,    Optoelektronik und Anzeigetechnik

All registered papers will be published in Springer - Lecture Notes in Electrical Engineering. (Scopus Indexed)

Tel.: [9500406834];     Email: iccces2019@gmail.com

The annual International Conference on Ad Hoc Networks (AdHocNets) focuses on ad hoc networking technologies and their applications. An ad hoc network is a wireless system, in which mobile or static nodes are connected using wireless links and cooperate to self-organize into a network without the requirement for any infrastructure such as access points or base stations. In recent years, ad hoc networks have been attracting an increased attention from the research and engineering communities. The distributed and multi-hop nature of ad hoc networking as well as the highly dynamic topology of an ad hoc network due to node mobility has introduced many formidable challenges such as scalability, quality of service, reliability and security, and energy constrained operations for the network. Ad hoc networking covers a variety of network paradigms including mobile ad hoc networks (MANETs), wireless sensor networks (WSNs), vehicular ad hoc networks (VANETs), airborne networks, underwater networks, underground networks, personal area networks, and home networks, etc. It promises a wide range of applications in civilian, commercial, and military areas.

Mobile ad hoc networks (MANET), Vehicle ad hoc networks (VANET), Unmanned aerial vehicle (UAV) networks, Wireless sensor networks, Airborne networks, Underwater networks, Underground networks, Personal area networks, Body area networks, Home networks, Internet of Things (IoT), Network architectural and protocol design, MAC, routing, and transport protocols, Resource allocation and management, Network control and management, Power control and management, Topology control and management, Quality of service (QoS) provisioning, Service discovery, Ranging and node localization, Time synchronization, Data aggregation, Network scalability and capacity, Reliability and fault tolerance, Security and privacy, Low, power wide, area IoT networking, Massive machine connections for IoT, Middleware for ad hoc networks, Cross, layer design for ad hoc networks, Software, defined networking for ad hoc networks, Network function virtualization for ad hoc networks, Edge/fog/cloud computing for ad hoc networks, Machine learning (or AI) for ad hoc networks, Performance modeling and analysis for ad hoc networks, Tools to design, implement, and evaluate ad hoc network protocols

Netzwerke, Internet,    Internet der Dinge (IoT) und Sensornetze

The main objective of the 4th CMES conference is development of engineering sciences, numerical and experimental techniques, broaden experience and good practices by representatives of the scientific community and industry. Conference allows exchange of knowledge between different research domestic and foreign centres representing various fields of engineering science and technology. Conference materials available in open access mode with the DOI number will be reported for indexation in the Web of Science and Scopus database.

Tel.: [+48815384303];     Email: contact@cmes.pl

•Analysis of engineering processes •Application of computer programs in technology •Artificial and computational intelligence •Computational fluid dynamics (CFD) •Computer simulations of processes and phenomena •Finite Element Method (FEM) •Material properties and structure research methods •Production engineering and quality control

Ingenieurwesen,    Maschinenbau

On Thursday 28 November 2019 the fourth edition of the Benelux RF Conference will take place at the Novio Tech Campus Nijmegen. The event brings together high tech professionals and companies involved in the development and application of high-end RF techniques. There will be sessions on product-specific applications with a focus on innovative solutions in combination with advanced wireless technology AND in-depth sessions highlighting trends such as RF energy and RF power and focusing on engineers, designers and technical managers in the advanced RF field.

RF energy, RF power, wireless technologie, high-end RF techniques

Messen und Ausstellungen,    Elektrostatik, elektromagnetische Wellen

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

VDI Wissensforum GmbH

High Power Charging verkürzt massiv die Ladezeiten für Elektrofahrzeuge. Diskutieren Sie auf der 2. VDI-Fachkonferenz „EV Batteriesysteme und Ladetechnik. Herausforderung High Power Charging“ das Potenzial und die Risiken dieser neuen Technologie entlang der gesamten Wertschöpfungskette und erfahren Sie, was sie für den Lademix der Zukunft bedeutet. Nutzen Sie den interdisziplinären Austausch, um praktische Lösungen für Aufgabenstellungen in Ihrem Unternehmen und neue Kooperationsmöglichkeiten zu finden.

Email: kleusberg@vdi.de

Batteriesysteme, Ladetechnik, Charging, High Power Charging, HPC, EV, Lademix, stationäre Speicher, Taycan, Ladezeit, Carbon-free, Elektromobilität

Batterien,    Ingenieurwesen

The conference will cover the entire scope of microwave and millimeter wave engineering, including RF/microwave/THz, antennas & propagation and EMC/EMI.

Active Devices and Circuits. Passive Components, Systems, Antennas and Propagation, Nano-electromagnetics, artificial intelligence, machine learning and deep learning for wireless applications, electromagnetic-acoustics, and other relevant topics.

Engineering Math. & Physics department, Faculty of Engineering, Cairo University, Egypt

The conference focuses on the recent advances in the theoretical and applied mathematical analysis, mechanics and physics in engineering. The RAEMP conference serves as a platform for the entire community of engineering sciences to meet and to exchange results and details of recent techniques of the field. Authors are invited to submit original, unpublished papers on all aspects of Engineering and applied Math, physics and mechanics.

Tel.: [+20235678065];     Email: raemp2019@eng1.cu.edu.eg

Applied mechanics, Computational physics, Condensed matter, General physics and physics education, Computational Electromagnetics, Computational intelligence, Computational solid and fluid mechanics, Methods for physical analysis and measurement, Modelling and simulation, Optimization, Parallel-processing, Physics and nano-technology, Optoelectronics and photonics, Renewable energy and photovoltaics, Solid-state physics

Computerphysik und Numerische Simulation,    Mustererkennung und Bildverarbeitung, Maschinelles Sehen

Sichuan Institute of Electronics

We welcome research that explores how to make the interaction between computers and people smarter, which may leverage solutions from data mining, knowledge representation, novel interaction paradigms, and emerging technologies.

Allgemeine und fachübergreifende Veranstaltugen in Informatik,    Benutzerschnittstellen, User Experience

The conference programme will highlight the most innovative and exciting aspects of large-area electronics (including printable, flexible, plastic, organic and bio- electronics), emerging technologies, their manufacture and the development of products incorporating large-area electronics. innoLAE has been particularly successful at attracting an equal balance of delegates from industry and academia, facilitating both dissemination and networking opportunities for researchers and key-decision makers in the LAE community. innoLAE provides an important platform to help bring innovation into the market and accelerate take up of new technologies.

Tel.: [+44 1223 748345];     Email: info@largeareaelectronics.org

Flexible electronics, plastic electronics, bioelectronics, printed electronics, organic seminconducotrs, graphene and 2D materials, IoT, sensors, energy harvesting, energy storage, OLEDs, flexible displays, hybrid integration, large-area electronics, wearables, e-textiles

Microsystems Technology Laboratories (MTL)

The Microsystems Annual Research Conference (MARC) is a long-running event celebrating the scientific achievements of students and staff pursuing research at the frontiers of micro/nanotechnology at MIT. Tracing its roots to the semesterly VLSI Research Reviews of the mid-80s, over the years, MARC has evolved into a student-run conference that hosts over 200 attendees, bringing together students, postdocs, faculty, and industrial partners. For the first time, this year, MARC will be co-hosted by MTL and MIT.Nano!

Mikrotechnologie, Nanotechnologie,    Halbleiterphysik

NAVAIR, PMA-209

Showcase of never-before-seen developments in the growing open market ecosystem. Live demonstrations on Systems Acquisition and Integration, Module Specification and Development, Conformance (qualification) and Open Systems Realization. Find out exactly how the new maturity of modular open systems approach technology will greatly increase defense program efficiency, accelerate the acquisition of the latest capabilities, and improve adaptability in currently fielded systems.

Tel.: [5037058651];     Email: sally@sallybixby.com

technology, hardware, software, modularopensystems, sosa, cmoss,

Messen und Ausstellungen,    Softwareentwicklung

SPIE Photonics West is the world's largest photonics technologies event. Over 22,000 people attend Photonics West each year to learn, connect, and find the latest research and products. Topics cover biomedical optics, biophotonics, lasers, industrial lasers, optoelectronics, microfabrication, MOEMS-MEMS, displays, and more. Six days, two exhibitions, 1,450 companies, 5,200 papers, networking events, industry sessions, courses, and a co-located AR, VR, MR conference make this the most important annual event in the optics and photonics market—and the industries they enable.

Customer Service;     Tel.: [+1 360 676 3290];     Email: customerservice@spie.org

photonic, call for papers, photonics, spectroscopy, spie photonics west, photonics west, laser technology, photonic crystals, spie photonic west, photonic conference, nonlinear optics, neurosurgery conference, laser sources, photonics conferences, quantum applications, ultrafast optics, neurophotonics, photonic technology, biomedical optics, biomedical imaging

Optik und Laser,    Optoelektronik und Anzeigetechnik

ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.

Computerhardware,    Halbleiterphysik

Electrical Engineering Academic Association of Thailand (EEAAT)

The 2020 International Electrical Engineering Congress (iEECON2020) is a premier international academic conference organized by the Electrical Engineering Academic Association of Thailand (EEAAT). The iEECON2020 will provide a forum for researchers, engineers and industry experts to discuss recent developments, new ideas and breakthroughs in Electrical Engineering technologies.

power & energy, communications, electronics & control, digital signal processing, and computer & IT

GOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC, and provides a forum for government reviews.

Microelectronics for a New Decade: Global Competition and Near-Peer Challenges

ACM - Association for Computing Machinery

The ACM sponsored TAU series of workshops provide an informal forum for practitioners and researchers working on temporal aspects of digital systems to disseminate early work and engage in a free discussion of ideas. The twenty-seventh in the TAU series, and on its 30th anniversary, the TAU 2020 workshop emphasizes novel aspects of timing and power analysis as well as optimization with special invited talks. TAU also organizes a student contest each year, this year the contest topic is "Delay calculation using current models". More details can be found on the TAU website (www.tauworkshop.com)

General Chair;     Tel.: [+1 978 502 0825];     Email: joao.geada@ansys.com

static timing analysis, statistical timing analysis, design optimization, power optimization, variability, clock design, library characterization

Halbleiterphysik,    Algorithmen

On behalf of the Organizing Committees and Industrial Electronics Society of the IEEE, it is our pleasure to welcome you to the IEEE International Workshop on Advanced Motion Control (AMC2020) that will be held on April 20-22, 2020, at the University of Agder, Campus Kristiansand, in Norway. Following to the last AMC2018 in Tokyo, Japan, our wish is to continue bringing together the researchers from both academia and industry and to maintain a highest scientific conference level, with enriching meetings and discussions and interesting and memorable events and experiences.

Elektrotechnik,    Robotik, Automatisierung & Mechatronik

National Oceanic and Atmospheric Administration

The conference addresses the remarkably diverse impacts of space weather on today's technology. The program highlights space weather impacts in several areas, including communications, navigation, spacecraft operations, aviation, and electric power. The workshop will also focus on the highest priority needs for operational services that can guide future research and new high-value capabilities that can be transitioned into operations. The conference fosters communication among researchers, space weather service providers, and users of space weather services.

Meteorologie und Klimaveränderung,    Elektrostatik, elektromagnetische Wellen

The Institution of Engineering and Technology.

Elektrotechnik,    Maschinenbau

Asia Pacific Electromagnetic Compatibility Society of Australia

Modern Society is increasingly becoming more connected and the technology that is enabling this to happen is operating in a complex and hostile electromagnetic environment. As such knowledge and practical experience in EMC design, mitigation and testing is increasingly in demand.

Elektrostatik, elektromagnetische Wellen,    Elektrotechnik

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

Kaunas University of Technology

The 24th International Conference ELECTRONICS 2020 (#electronicsconf) will take place in Palanga, Lithuania from 15th to 17th June, 2020. ELECTRONICS 2020 is organized by Kaunas University of Technology, Department of Electronics Engineering. Representatives from science and study institutions, industry and business are invited for joint discussion to evaluate present situation of ELECTRONICS science and industry, foresee ways for effective implementation of science achievements into industry and to exchange with research results. We cordially invite you to participate and submit your contribution to ELECTRONICS 2020.

Tel.: [+370 37 300519];     Email: electronics@ktu.lt

Automation, Robotics and Control; Electrical Engineering; Electronic Measurements; Electronics; High Frequency Technology, Microwaves; Nano- / microelectronics; Renewable Energy; Signal Technology; System Engineering, Computer Technologies; Telecommunications Engineering;

Elektrotechnik,    Robotik, Automatisierung & Mechatronik

International Frequency Sensor Association (IFSA)

The conference is the third of a series of annual International Conferences on Microelectronic Devices and Technologies (MicDAT) held in Barcelona (Spain), 2018 and in Amsterdam (The Netherlands), 2019 organized by IFSA. The MicDAT' 2020 conference is intended to create awareness of the huge potential of modern microelectronic technologies and to improve understanding on the recent challenges in a wide range of applications. The many different technological bases for the fabrication of microelectronic devices, SoC, SiP, MEMS and NEMS will be outlined in this 3-day conference. A number of recognized experts from both: academy and industry in the field of microelectronic design will be invited to give their view in selected application areas. Featuring strong participation of industry and academia, the MicDAT' 2020 conference will provide an excellent opportunity to exchange ideas and present latest advancements in these areas. The aim of MicDAT series of conference is to provide an annual world forum for the presentation and discussion of recent advances in microelectronics, and bring together leading international researchers, engineers and practitioners interested on any of the microelectronics related technologies. The conference will offer plenary and invited talks, contributed oral and poster presentations, special sessions, tutorials, and exhibitions of commercial products. Social and cultural events will also take place to foster networking among the participants in a friendly manner. The conference is coordinated with the IFSA series of conferences, which deal with physics and engineering.

Tel.: [+34696067716];     Email: syurish@sensorsportal.com

microelectronics, semiconductors, microelectronic devices, nanoelectronics, MEMS, NEMS, microelectronic technology

Mikrotechnologie, Nanotechnologie,    Halbleiterphysik

co-sponsored by the IEEE Electron Device Society and MRS

Materials Research Society (MRS)

The Electronic Materials Conference (EMC) is the premier annual forum on the preparation, characterization and use of electronic materials.

Festkörperphysik,    Halbleiterphysik

The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).

Robotik, Automatisierung & Mechatronik,    Maschinenbau

Dans mon pays , nous voulons apprendre comment faire la stabilité du erseau électrique avec extension

Tel.: [253 77 76 66 70];     Email: ahmed.salebanhassan1988hotmail.com

8th CIGRE Session 23 aou 2020 - 28 aou 2020 • Paris, France Organisateur: CONSEIL INTERNATIONAL des GRANDS RESEAUX ELECTRIQUES (CIRGE) Identifiant de l'évènement: 1230110 Sujets apparentés: Électrotechnique Page web: https://www.cigre.org/GB/events/cigre-session-2020

Batterien,    Stromversorgungsnetz, Intelligentes Stromnetz

This symposium pertains to the field of electromagnetic compatibility.

For more than five decades, ASC has been an important gathering point for the electronics, large scale, and materials fields within the applied superconductivity community. The 2020 theme, “Bringing Horizons into Clear View,” acknowledges the excitement of superconductivity and the predictions made in the past, the long journey many applications have taken to come to fruition, and the promising opportunities yet to come.

Quantenmaterialien, Tieftemperaturphysik,    Angewandte Physik (allgemein)

The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).

Robotik, Automatisierung & Mechatronik,    Maschinenbau

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.