Tagungen und Workshops zum Thema Elektronik

IEEE Electron Devices Technology and Manufacturing Conference (EDTM) is intended to serve as a forum for the electron devices community to collaborate on topics ranging from devices, materials, and tools, to create new and innovative technologies.

Tel.: [+81 3 5657 0777];     Email: edtm@jtbcom.co.jp

Devices and Manufacturing for

Ingenieurwesen,    Optoelektronik und Anzeigetechnik

Bringing together the two major wireless power events: IEEE MTT-S Wireless Power Transfer Conference (WPTC) and IEEE PELS Workshop on Emerging Technologies: Wireless Power (WoW)

co-sponsored by the IEEE Electron Device Society and MRS

The DRC, co-sponsored by the IEEE Electron Devices Society and the Materials Research Society, is coordinated with the 61st Electronic Materials Conference (EMC), held later that week. This recognizes the importance of interactions between device and electronic materials research, and provides for a fruitful exchange of information between attendees of both conferences.

The V International Conference on Innovations in Non-Destructive Testing SibTest-2019 is devoted to discussion of NDT innovative methods and implementation of advanced technologies in NDT, as well as development of research cooperation between the scientists from different countries.

Tel.: [+79234262629];     Email: ivanovatonya@tpu.ru

Non-Destructive Testing, Technical Diagnostics, Industrial Safety, Digital Technologies, Medical Application, Signal and Image Processing, Health Data Automated, Acquisition and Processing, Materials for NDT, Electronic Engineering, Measurement data processing, Welding and Related Technologies

Ingenieurwesen,    Metallurgie und Werkstoffkunde

Materials Research Society (MRS)

The Electronic Materials Conference (EMC) is the premier annual forum on the preparation, characterization and use of electronic materials. The 2019 Conference, to be held June 26-28 at the University of Michigan, immediately follows the Device Research Conference and will feature a plenary session, parallel topical sessions, a poster session and an industrial exhibition.

Festkörperphysik,    Festkörperphysik: Halbleiterphysik

IWMTS is an annual International Workshop on Mobile Terahertz Systems. It is organized by the Institute of Digital Signal Processing of University of Duisburg-Essen.

The conference will present high-impact scientific and technological advances in materials and devices based on group-III nitride semiconductors, and will feature plenary sessions, parallel topical sessions, poster sessions and an industrial exhibition. The 13th International Conference on Nitride Semiconductors (ICNS-13) will feature a combination of invited and contributed talks, poster sessions and tutorials showcasing recent scientific results in a wide range of neutron science fields. The ICNS Exhibit offers the most direct access to researchers from around the world who are seeking technical solutions to their challenges. If you are involved in the nitride semiconductor community, then you need to be part of this conference.

Conference offers a one day "Short Course" and 3.5 days of Tehchnical sessions consisting of 8-10 session of contributed papers. The material presented is completely related to the radiation environment and its impact on electrical components and materials

The 13th IEEE International Conference on Power Electronics and Drive Systems (PEDS 2019) will be held in Toulouse, France on 9 – 12 July 2019. The conference is a biennial event and is recognized as one of the major series of conferences in power electronics and drive systems. PEDS 2019 continues to retain its tradition of high quality conference and will open up an opportunity for academics and industrial professionals worldwide to exchange their knowledge of the state-of-the-art power electronics and drive technologies and applications. The 4-day programme will feature tutorials and technical paper presentations.

This Symposium explores emerging trends and novel ideas and concepts in the area of VLSI. The Symposium covers a range of topics: from VLSI circuits, systems and design methods to system level design and system-on-chip issues, to bringing VLSI experience to new areas and technologies. Future design methodologies as well as new CAD tools to support them will also be the key topics. ISVLSI 2019 highlights a special theme of Neuromoprhic Computing. Over almost two decades the Symposium has been a unique forum promoting multidisciplinary research and new visionary approaches in the area of VLSI.

ISEC2019 will showcase four areas in superconducting electronics that have been rapidly growing over the last few years, Quantum Information, Detectors, SQUIDs, and Digital Electronics. In addition, new emerging areas such as topological superconducting devices, and neuromorphic computing will also play a central role in the program.

Festkörperphysik: Tieftemperaturphysik,    Quantenmechanik und Quanteninformation

The Optical Society (OSA)

The OSA Advanced Photonics Congress addresses the many aspects of photonic device research and development and their use in networks.

Optoelektronik und Anzeigetechnik,    Computerhardware

8th International Conference on "Innovations in Electronics and Communication Engineering (ICIECE-2019)” aims to provide an opportunity for researchers, scientists, technocrats, academicians and engineers to exchange their innovative ideas and research findings in the field of Electronics and Communication Engineering. The conference will provide interactive platform for the participants and other delegates from the academic and industry segments across India and globe to share their research experience, experiment break through or vision-trends.

Tel.: [+917729993428];     Email: infoiciece@gniindia.org

SIGNAL PROCESSING, EMBEDDED SYSTEMS, ANTENNA / MICROWAVE, VLSI, BIOMEDICAL ELECTRONICS, COMMUNICATION

The Summer School is organized by IHP - Innovations for High Performance Microelectronics and Materials Science coordination group of University of Rome Tor Vergata. The event will take place at IHP (Frankfurt (Oder) - Germany) and University of Rome Tor Vergata, Department of Industrial Engineering (Rome - Italy) from 25th until 31st of August 2019.

The objective of this summer school: Novel technologies enable the future demands of the society for increasing high speed data transfer and broad band communication systems. Silicon photonics is a key enabling technology which fulfills these demands. Beside these mainstream applications Si-Photonic technologies in particular electronic-photonic-integrated-circuit (EPIC) technologies are foreseen for extra-terrestrial and medical applications as intra satellite communication. For this reasons higher requirements with respect to stability and reliability of components and modules. Purpose of the “German-Italian-Summer-School” is to provide inside view to recent developments in the field of photonics technologies, circuits and systems. Moreover novel developments and challenges for high performance technologies in harsh environments are presented and discussed. We want to teach and discuss these developments and give the opportunity to create the future – join us!

Email: summerschool@ihp-microelectronics.com

Summer School, Summer, School, Photonic, technologies, for, harsh, environments, space applications, Italy, Germany, IHP, Innovations, for, High, Performance, Microelectronics, Leibniz-Institut, innovative, Mikroelektronik, Frankfurt (Oder), Rome, Rom, Informatik, Physik, Elektrotechnik, Electrical Engineering, Materials Science, Tor Vergata, TH Wildau, Instituto, Nazionale, di Fisica Nucleare, INFN, Italian Space Agency, ASI, M.Sc., PhD, studies, Sommerschule,

Kurse und Veranstaltungen für Physikstudenten,    Optoelektronik und Anzeigetechnik

The Summer School is organized by IHP - Innovations for High Performance Microelectronics and Materials Science coordination group of University of Rome Tor Vergata. The event will take place at IHP (Frankfurt (Oder) - Germany) and University of Rome Tor Vergata, Department of Industrial Engineering (Rome - Italy) from 25th until 31st of August 2019.

The objective of this summer school: Novel technologies enable the future demands of the society for increasing high speed data transfer and broad band communication systems. Silicon photonics is a key enabling technology which fulfills these demands. Beside these mainstream applications Si-Photonic technologies in particular electronic-photonic-integrated-circuit (EPIC) technologies are foreseen for extra-terrestrial and medical applications as intra satellite communication. For this reasons higher requirements with respect to stability and reliability of components and modules. Purpose of the “German-Italian-Summer-School” is to provide inside view to recent developments in the field of photonics technologies, circuits and systems. Moreover novel developments and challenges for high performance technologies in harsh environments are presented and discussed. We want to teach and discuss these developments and give the opportunity to create the future – join us!

Email: summerschool@ihp-microelectronics.com

Summer School, Summer, School, Photonic, technologies, for, harsh, environments, space applications, Italy, Germany, IHP, Innovations, for, High, Performance, Microelectronics, Leibniz-Institut, innovative, Mikroelektronik, Frankfurt (Oder), Rome, Rom, Informatik, Physik, Elektrotechnik, Electrical Engineering, Materials Science, Tor Vergata, TH Wildau, Instituto, Nazionale, di Fisica Nucleare, INFN, Italian Space Agency, ASI, M.Sc., PhD, studies, Sommerschule,

Kurse und Veranstaltungen für Physikstudenten,    Optoelektronik und Anzeigetechnik

SLED is the IEEE International Symposium on Sensorless Control for Electrical Drives presenting the state of the art and future perspective of Sensorless Drives. The Symposium will present the latest advancements and future perspectives of sensorless control for electric motor drives and grid-connected converters, gathering international experts from the academia and the industry. We would be delighted to have your input at the symposium and your contribution to discussions on present trends and opportunities in this field.

The conference presents the status and trends in the multidisciplinary fields of microwave and radiofrequency heating, dielectric properties, material processing, high power systems and technologies.

ETFA 2019 is the 24th Annual Conference of the IEEE Industrial Electronics Society (IES) focusing on the latest developments and new technologies in the field of industrial and factory automation. The conference aims to disseminate novel ideas and emerging trends, research results and practical achievements.

Ingenieurwesen,    Elektrotechnik

Measurement, analysis and testing processes, Measurement techniques and best practices, Technologies, R&D, Prospects

European Microwave Association (EuMA)

Angewandte Physik: Elektrostatik, elektromagnetische Wellen,    Messen und Ausstellungen

RADAR2019 is in the frame of the international relations set up between the IET, the IEEE, the CIE, the IEAust and the SEE. The conference will focus on new research and developments in the fields: Radar Systems (ground based, airborne, spaceborne), Radar Environment and Phenomenology, Electromagnetic Modeling Radar Component Technologies, Remote Sensing from Airborne or Spaceborne Systems, SAR & ISAR Imagery Waveform design, beamforming and signal processing Emerging, Radar Applications, Smart Visualization and Information processing, System Modeling, Simulation and Validation, Radar Management Techniques Automatic Classification. The conference will take place at Toulon Neptune Palais. Located on the French Riviera, Toulon is an important centre for naval construction and aeronautical equipment,hosting the major naval centre on France's Mediterranean coast, also home of the French Navy aircraft carrier Charles De Gaulle.

Angewandte Physik,    Teilchenbeschleuniger

The European Microwave Association (EuMA)

The 42nd edition of the International Semiconductor Conference - CAS 2019, an IEEE event, will continue the long-standing tradition of the conference started in 1978 to address selected topics of scientific research and technological development in the semiconductor electronics.

Festkörperphysik: Halbleiterphysik,    Optoelektronik und Anzeigetechnik

INTELEC® is a global technical community dealing with the science and engineering of the energy and power systems needed to operate critical and high-availability information communications technology (ICT) networks and infrastructure.

Email: info@intelec2019.org

DC Power System, Thermal Management, Energy Management, Telecommunications Network, Renewable & Alternative Energy Resources

This workshop is the 2019 edition of a series of workshops on silicon quantum electronics that have taken place roughly once a year since 2007.

Festkörperphysik: Halbleiterphysik,    Quantenmechanik und Quanteninformation

Phased array systems have made major steps forward with the development of many major radar and communications systems. Due to many recent advances, including MMIC, photonics, and digital beamforming, phased array systems and technology continue to progress rapidly. Current and future developments of ground -based, sea-based, airborne, and space -based phased array radar, communications, and other electronic systems will be discussed at this international symposium.

The international VDI Congress ELIV (Electronics In Vehicles) is THE event for all experts in the field of electrical and electronical car engineering and integration of mechanical and electronical systems.

The International Academy, Research and Industry Association (IARIA)

Part of NetWare 2019

Messtechnik,    Internet der Dinge (IoT) und Sensornetze

The International Academy, Research and Industry Association (IARIA)

Part of NetWare 2019

Messtechnik,    Internet der Dinge (IoT) und Sensornetze

The International Academy, Research and Industry Association (IARIA)

Part of NetWare 2019

BCICTS is the premier forum for developments in bipolar, BiCMOS, and compound semiconductor integrated circuits, devices, and technology. Coverage includes all aspects of the technology: materials, device fabrication, device phenomena, TCAD modeling, compact modeling, integrated circuit design, testing, and system applications. A wide range of integrated circuit technologies are covered, including bipolar, BiCMOS, SiGe, GaAs, GaN, InP, SiC, and CMOS. The latest results in wireless, analog, RF, microwave, high-speed digital, mixed signal, optoelectronic, millimeter wave, and THz integrated circuits are embraced.

International Test Conference, the cornerstone of TestWeek events, is the premier conference dedicated to the electronic test of devices, boards and systems – covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment designers, and test engineers

The International Microwave and Optoelectronics Conference was initiated in 1985, biennially, aiming at exchange and dissemination of scientific and technological knowledges. It is currently an event sponsored by the Brazilian Microwave and Optoelectronic Society (SBMO) and the IEEE Microwave Theory and Techniques Society (MTT-S). For the first time since its creation IMOC will leave the Brazilian territory and will be held in Portugal. The organization will be in charge of the Instituto de Telecomunicações / Universidade de Aveiro / Instituto Superior Técnico and the Federal University of Espírito Santo.

Advances and Challenges in Communication Technology

Angewandte Physik: Elektrostatik, elektromagnetische Wellen,    Optoelektronik und Anzeigetechnik

All registered papers will be published in Springer - Lecture Notes in Electrical Engineering. (Scopus Indexed)

Tel.: [9500406834];     Email: iccces2019@gmail.com

The annual International Conference on Ad Hoc Networks (AdHocNets) focuses on ad hoc networking technologies and their applications. An ad hoc network is a wireless system, in which mobile or static nodes are connected using wireless links and cooperate to self-organize into a network without the requirement for any infrastructure such as access points or base stations. In recent years, ad hoc networks have been attracting an increased attention from the research and engineering communities. The distributed and multi-hop nature of ad hoc networking as well as the highly dynamic topology of an ad hoc network due to node mobility has introduced many formidable challenges such as scalability, quality of service, reliability and security, and energy constrained operations for the network. Ad hoc networking covers a variety of network paradigms including mobile ad hoc networks (MANETs), wireless sensor networks (WSNs), vehicular ad hoc networks (VANETs), airborne networks, underwater networks, underground networks, personal area networks, and home networks, etc. It promises a wide range of applications in civilian, commercial, and military areas.

Mobile ad hoc networks (MANET), Vehicle ad hoc networks (VANET), Unmanned aerial vehicle (UAV) networks, Wireless sensor networks, Airborne networks, Underwater networks, Underground networks, Personal area networks, Body area networks, Home networks, Internet of Things (IoT), Network architectural and protocol design, MAC, routing, and transport protocols, Resource allocation and management, Network control and management, Power control and management, Topology control and management, Quality of service (QoS) provisioning, Service discovery, Ranging and node localization, Time synchronization, Data aggregation, Network scalability and capacity, Reliability and fault tolerance, Security and privacy, Low, power wide, area IoT networking, Massive machine connections for IoT, Middleware for ad hoc networks, Cross, layer design for ad hoc networks, Software, defined networking for ad hoc networks, Network function virtualization for ad hoc networks, Edge/fog/cloud computing for ad hoc networks, Machine learning (or AI) for ad hoc networks, Performance modeling and analysis for ad hoc networks, Tools to design, implement, and evaluate ad hoc network protocols

Netzwerke, Internet,    Internet der Dinge (IoT) und Sensornetze

The main objective of the 4th CMES conference is development of engineering sciences, numerical and experimental techniques, broaden experience and good practices by representatives of the scientific community and industry. Conference allows exchange of knowledge between different research domestic and foreign centres representing various fields of engineering science and technology. Conference materials available in open access mode with the DOI number will be reported for indexation in the Web of Science and Scopus database.

Tel.: [+48815384303];     Email: contact@cmes.pl

•Analysis of engineering processes •Application of computer programs in technology •Artificial and computational intelligence •Computational fluid dynamics (CFD) •Computer simulations of processes and phenomena •Finite Element Method (FEM) •Material properties and structure research methods •Production engineering and quality control

Ingenieurwesen,    Maschinenbau

On Thursday 28 November 2019 the fourth edition of the Benelux RF Conference will take place at the Novio Tech Campus Nijmegen. The event brings together high tech professionals and companies involved in the development and application of high-end RF techniques. There will be sessions on product-specific applications with a focus on innovative solutions in combination with advanced wireless technology AND in-depth sessions highlighting trends such as RF energy and RF power and focusing on engineers, designers and technical managers in the advanced RF field.

RF energy, RF power, wireless technologie, high-end RF techniques

Messen und Ausstellungen,    Angewandte Physik: Elektrostatik, elektromagnetische Wellen

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

The conference will cover the entire scope of microwave and millimeter wave engineering, including RF/microwave/THz, antennas & propagation and EMC/EMI.

Active Devices and Circuits. Passive Components, Systems, Antennas and Propagation, Nano-electromagnetics, artificial intelligence, machine learning and deep learning for wireless applications, electromagnetic-acoustics, and other relevant topics.

Engineering Math. & Physics department, Faculty of Engineering, Cairo University, Egypt

The conference focuses on the recent advances in the theoretical and applied mathematical analysis, mechanics and physics in engineering. The RAEMP conference serves as a platform for the entire community of engineering sciences to meet and to exchange results and details of recent techniques of the field. Authors are invited to submit original, unpublished papers on all aspects of Engineering and applied Math, physics and mechanics.

Tel.: [+20235678065];     Email: raemp2019@eng1.cu.edu.eg

Applied mechanics, Computational physics, Condensed matter, General physics and physics education, Computational Electromagnetics, Computational intelligence, Computational solid and fluid mechanics, Methods for physical analysis and measurement, Modelling and simulation, Optimization, Parallel-processing, Physics and nano-technology, Optoelectronics and photonics, Renewable energy and photovoltaics, Solid-state physics

Computerphysik und Numerische Simulation,    Angewandte Mathematik: Mustererkennung und Bildverarbeitung, Maschinelles Sehen

Sichuan Institute of Electronics

We welcome research that explores how to make the interaction between computers and people smarter, which may leverage solutions from data mining, knowledge representation, novel interaction paradigms, and emerging technologies.

Allgemeine und fachübergreifende Veranstaltugen in Informatik,    Benutzerschnittstellen

SPIE Photonics West is the world's largest photonics technologies event. Over 22,000 people attend Photonics West each year to learn, connect, and find the latest research and products. Topics cover biomedical optics, biophotonics, lasers, industrial lasers, optoelectronics, microfabrication, MOEMS-MEMS, displays, and more. Six days, two exhibitions, 1,450 companies, 5,200 papers, networking events, industry sessions, courses, and a co-located AR, VR, MR conference make this the most important annual event in the optics and photonics market—and the industries they enable.

Customer Service;     Tel.: [+1 360 676 3290];     Email: customerservice@spie.org

photonic, call for papers, photonics, spectroscopy, spie photonics west, photonics west, laser technology, photonic crystals, spie photonic west, photonic conference, nonlinear optics, neurosurgery conference, laser sources, photonics conferences, quantum applications, ultrafast optics, neurophotonics, photonic technology, biomedical optics, biomedical imaging

Optik und Laser,    Optoelektronik und Anzeigetechnik

ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.

On behalf of the Organizing Committees and Industrial Electronics Society of the IEEE, it is our pleasure to welcome you to the IEEE International Workshop on Advanced Motion Control (AMC2020) that will be held on April 20-22, 2020, at the University of Agder, Campus Kristiansand, in Norway. Following to the last AMC2018 in Tokyo, Japan, our wish is to continue bringing together the researchers from both academia and industry and to maintain a highest scientific conference level, with enriching meetings and discussions and interesting and memorable events and experiences.

Elektrotechnik,    Robotik, Automatisierung & Mechatronik

National Oceanic and Atmospheric Administration

The conference addresses the remarkably diverse impacts of space weather on today's technology. The program highlights space weather impacts in several areas, including communications, navigation, spacecraft operations, aviation, and electric power. The workshop will also focus on the highest priority needs for operational services that can guide future research and new high-value capabilities that can be transitioned into operations. The conference fosters communication among researchers, space weather service providers, and users of space weather services.

Meteorologie und Klimaveränderung,    Angewandte Physik: Elektrostatik, elektromagnetische Wellen

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

co-sponsored by the IEEE Electron Device Society and MRS

Materials Research Society (MRS)

The Electronic Materials Conference (EMC) is the premier annual forum on the preparation, characterization and use of electronic materials.

Festkörperphysik,    Festkörperphysik: Halbleiterphysik

The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).

Robotik, Automatisierung & Mechatronik,    Maschinenbau

This symposium pertains to the field of electromagnetic compatibility.

The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).

Robotik, Automatisierung & Mechatronik,    Maschinenbau

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.