Track 1: Semiconductor Devices & Materials: Advanced semiconductor materials (SiC, GaN, 2D materials); High-performance transistors (FinFET, GAA, TFET); Power semiconductor devices and modules; MEMS/NEMS devices and sensors; Flexible and stretchable electronics; Organic and hybrid semiconductor devices; Wide-bandgap semiconductor technologies; Novel memory devices (RRAM, MRAM, FeRAM); Optoelectronic materials and devices. Track 2: Integrated Circuits & VLSI Design: Analog/mixed-signal IC design; RF and millimeter-wave integrated circuits; Low-power and energy-efficient ICs; 3D/heterogeneous integration technologies; FPGA and reconfigurable architectures; Neuromorphic and bio-inspired circuits; EDA tools and methodologies; Testing and reliability of ICs; AI/ML-accelerated chip design. Track 3: Optoelectronics & Photonic Devices: Photodetectors and image sensors; LEDs, lasers, and display technologies; Silicon photonics and plasmonics; Optical communication devices; Quantum dot and nanophotonic devices; Integrated photonic circuits; Terahertz devices and systems; Solar cells and photovoltaic technologies; AR/VR photonic components.