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HICSS 2023 — Analytics and Decision Support for Green IS and Sustainability Applications
03. Jan 2023 - 06. Jan 2023 • Maui, Hawaii, Vereinigte Staaten
Veranstalter:
Department of IT Management, Shidler College of Business University of Hawaii at Manoa
Zusammenfassung:
Professor PingSun Leung, Professor Arno Scharl, and I are co-chairing a minitrack at the upcoming Hawaii International Conference on Systems Sciences (HICSS 2023), January 3-6, Hyatt Regency, Maui, Hawaii, U.S.A. The minitrack is entitled " Analytics and Decision Support for Green IS and Sustainability Applications". As co-mini-track chairs we would like to personally invite you to submit a paper and/or serve as a reviewer for the mini-track. Since the inception of HICSS in 1968, HICSS authors have generated a sustained stream of innovative research ideas. According to Microsoft Academic, HICSS ranks the 36th in terms of citations among 4,444 conferences in all fields worldwide. The Australian Government’s Excellence in Research project (ERA) has given HICSS an “A” rating, one of 32 Information Systems conferences so honored out of 241 (46-B and 146-C ratings). Data supplied by the Australian Research Council, December 2009.
Kontakt:
Event Chair;     Email: omar.el-gayar@dsu.edu
Einsendeschluss für Abstracts:
15. Jun 2022
Eintrags-ID:
1481149
Verwandte Fachgebiete:
2
Digital Transformation Forum for the Steel Industry
07. Mär 2023 - 08. Mär 2023 • Pittsburgh, PA, Vereinigte Staaten
Veranstalter:
Association for Iron & Steel Technology (AIST)
Zusammenfassung:
The digital transformation (DT) journey continues to be a critical component for all steel companies. The 2023 Digital Transformation Forum for the Steel Industry will build on the success of the preceding forums and incorporate suggestions from attendees. Presentations on how machine learning works under the hood, change management and cultural challenges of implementing DT solutions, and additional panel discussions on actual use cases will be provided. In addition to machine learning and artificial intelligence topics, the forum will cover the importance and techniques for cybersecurity; the use of DT solutions for environmental and health and safety applications; practical uses of simulation, including augmented and virtual reality; and innovative uses of robotics. The essential roles that humans play in successful DT journeys will again be featured. These discussions include developing companywide initiatives, data visualization, self-serviced analytics and other aspects of human interaction.
Eintrags-ID:
1516782
Verwandte Fachgebiete:
3
ISPD 2023 — ACM International Symposium on Physical Design
26. Mär 2023 - 29. Mär 2023 • San Francisco , CA, Vereinigte Staaten
Veranstalter:
Association for Computing Machinery (ACM)
Zusammenfassung:
The International Symposium on Physical Design (ISPD) provides a premier forum to exchange ideas and promote innovative research in all aspects of physical design ranging from traditional topics for ASIC and FPGA designs to emerging technologies that impact physical design of integrated circuits (ICs). In 2023, ISPD will be online with virtual participation, with both live video and recorded sessions. The 32nd symposium will highlight key new directions and leading-edge theoretical and experimental contributions to the field.

We will also pay tribute to Professor Malgorzata Marek-Sadowska (University of California at Santa Barbara) for her contributions to the physical design community.

Einsendeschluss für Abstracts:
30. Sep 2022
Eintrags-ID:
1505306
Verwandte Fachgebiete:
4
PEARC '23 — Practice and Experience in Advanced Research Computing
23. Jul 2023 - 27. Jul 2023 • Portland, Oregon, Vereinigte Staaten
Veranstalter:
The PEARC conference series is sponsored by the Association for Computing Machinery (ACM) and its HPC and Applications special interest groups (SIGAPP and SIGHPC).
Eintrags-ID:
1505287


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