Conférences  >  Ingénieries  >  Ingénierie automobile et ferroviaire

ECV International

With the EU’s Fit-for-55 and Clean Industrial Deal leading the regulatory framework, OEMs are shifting towards low-carbon production processes, including electrification, sustainable raw material sourcing, green steel initiatives and etc. The summit will explore policy measures like the Carbon Border Adjustment Mechanism (CBAM), Scope 3 emissions, and the Sustainable Supply Chain Mapping to reduce the automotive sector’s environmental footprint. Sessions will showcase innovative business practices from OEMs to provide actionable insights for decarbonizing the full vehicle life cycle, from design, production to end-of-life management. This event aims to foster cross-industry collaboration, promote sustainable design, and showcase strategies that will accelerate Europe's path to a low-carbon automotive future.

Tél.: [8613271915990];     Email.: britney@ecvinternational.com

Automotive, Recycling, Battery, Carbon, Supply Chain, steel, Environment

Écosystèmes, environnement et développement durable,    Transport et logistique

ECV International

The 2nd European Automotive Circular Economy Summit 2026 will bring together leading stakeholders from across the automotive value chain, including OEMs, suppliers, recyclers, and policymakers, to explore strategies for creating a circular ecosystem in automotive production. Key areas of focus will include advancing the recycling of critical materials such as steel and plastics, addressing challenges in the management of end-of-life vehicles (ELVs), and incorporating eco-design principles into vehicle manufacturing to enhance recyclability. The summit will highlight the ongoing progress in circular supply chains, the role of green steel, and the regulatory developments driving change. Participants will also explore digital solutions like product passports to enable better material tracking and support the transition to a more sustainable, circular economy in the automotive sector.

Tél.: [8613271915990];     Email.: britney@ecvinternational.com

➤ Circular Economy Regulations: The European Commission’s Approach ➤ Industrializing Automotive Material Loops: The Roadmap to Full-Vehicle Circularity ➤ A Circular Future for Automotive Plastics ➤ Green Steel and Its Role in Decarbonizing Automotive Production ➤ Digital Product Passports as the Enabler for the Circular Economy ➤ A Holistic Life Cycle Engineering Approach in the Automotive Sector ➤ Eco-design: Shaping Vehicles for the Circular Economy ➤ Panel Discussion: Circular Economy in the Automotive Sector: Overcoming Challenges and Driving Innovation ……

Électrotechnique,    Transport et logistique

The significance and purpose of holding this symposium is to share and exchange information at the top-level of the progress of tribology research and its application to automotive technology between industry and academia, and to demonstrate the potential of industry-academia collaboration through these activities.

Mécanique, tribologie et rhéologie,    Génie mécanique

ECV International

This summit focuses on key topics such as Software-Defined Vehicles (SDV), the application of large AI models in autonomous driving and smart cockpits, centralized and zonal E/E architecture, 6G and V2X collaboration, data closed-loop systems, compliance, and security, etc. It aims to establish a cross-disciplinary platform for technical and strategic exchange, fostering in-depth collaboration among OEMs, technology firms, semiconductor companies, software providers, and regulatory bodies to jointly build a smarter, safer, and more sustainable future mobility ecosystem.

Tél.: [8613271915990];     Email.: britney@ecvinternational.com

ECV International

This summit centered on the theme "E/E Architecture Innovation in the Age of AI and SDV", will bring together leading global OEMs, Tier 1 suppliers, technology giants, and academic pioneers to explore how next-generation E/E architecture is shaping the foundation of intelligent vehicles; and discuss how AI acts as a central driving force, guiding the next revolution in E/E architecture across computing, communication, power distribution, and hardware-software integration—laying a solid foundation for building more efficient, intelligent, and secure future vehicles.

European Automotive E/E System Summit 2026;     Tél.: [8613271915990];     Email.: britney@ecvinternational.com

Driving Software-Centric Innovation: What’s Next for E/E Architecture From Distributed to Centralized: Architecting the Future of E/E Systems with AI The AI-Driven Automotive Revolution: From Centralized Computing to Autonomous Mobility Unlocking Central Compute Performance: How High-Speed In-Vehicle Networks Power AI-Defined Vehicle Next-Generation E/E Architectures: Scalability, AI Integration & Multi-Path Electrification Towards Gigabit Ethernet in SDV: OEM Challenges in Scaling Bandwidth, Safety and Real-Time Communication Sensor Fusion Architecture: Delivering High-Quality Data for AI Designing the Data Backbone: High-Speed In-Vehicle Networks in Centralized Vehicle Architectures Road to Cloud Mobility: Cross- Domain E/E Architecture Powering in SDV Era Securing SDV: From Embedded Security to Secure Boot and Partitioning

Électrotechnique,    Électronique

World Road Association (PIARC)