Conférences  >  Ingénieries  >  Électronique

Matériel informatique,    Salons, foire-exposition

OPTICA

Opto-électronique et technique d'affichage,    Semi-conducteurs

Association for Computing Machinery (ACM)

The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of recent advances in all aspects of low power design and technologies, ranging from process and circuit technologies, to simulation and synthesis tools, to system level design and optimization.

The 19th IEEE Conference on Industrial Electronics and Applications (ICIEA 2024) will be held on 05-08 August 2024, in Kristiansand, Norway. The Conference is organized by the IEEE Industrial Electronics Chapter of Singapore, the University of Agder, and the IEEE Singapore Section. The IEEE Industrial Electronics Society is both the financial and technical sponsor.

Punjab Engineering College, Chandigarh and IEEE Chandigarh Subsection

INDISCON is a flagship annual international conference of the IEEE India Council organized by an IEEE Subsection in INDIA. INDISCON 2024 scheduled during August 22-24, 2024, is being organized by IEEE Chandigarh Subsection along with IEEE India Council. The conference will be hosted by Punjab Engineering College (Deemed to be University), Chandigarh. The conference aims to provide an interdisciplinary platform for the academicians, researchers, industry professionals and research scholars to exchange and share their knowledge, experience & research. Papers that are selected and presented at the conference will be submitted to IEEE Xplore.

INDISCON;     Tél.: [+91-9417429699];     Email.: ieeeindiscon2024@gmail.com

Power and Energy Systems, Power Electronics, Drives and Intelligent Control, Instrumentation, Control and Signal Processing, Artificial Intelligence and Data Science, Communication, Networks & IoT, Next Generation Computing and Applications, Security & Privacy, RF/Microwave/Terahertz Technologies, Semiconductor Devices, VLSI & Embedded Systems, Nanotechnology Materials and Devices, Education Technologies, Women in Engineering

Électrotechnique,    Réseaux de neurones et intelligence artificielle, apprentissage automatique

SPIE - The international society for optics and photonics.

The premier technical meeting for mask makers, EUVL, and emerging technologies

Semi-conducteurs ,    Microtechnologie, nanotechnologie

The main organizer will be the Faculty of Electrical Engineering (FEE) of the UWB in Pilsen!

Électrotechnique,    Robotique, automation & mécatronique

ASME

It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles. The international nature of the meeting has been highly beneficial in promoting global interactions between industry, academia, research institutions, funding agencies, start-ups and entrepreneurs. In addition to paper presentations and exhibits, InterPACK 2024 will include panel discussions, workshops, tutorials, keynote and technology talks by prominent speakers, and a joint industry, national laboratory, and academia poster session.

Abstracts are due by February 19.

Email.: jakubowskim@asme.org

electronic packaging, engineering

The IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) technical sub-committees are organized to reflect the rapidly evolving developments in bipolar, BiCMOS and compound semiconductor circuits and devices. Submissions are encouraged in all areas of advanced circuits, devices and modeling.

Semi-conducteurs ,    Matériel informatique

This conference is sponsored by IEEE Industry Applications Society (IAS). This session will be organized by North China Electric Power University (NCEPU). It will also be co-organized by Shandong University, State Key Laboratory of Advanced Power Transmission Technology, University Alliance of Global Energy Interconnection (UAGEI), State Grid Pinggao Group Co., LTD. and Taikai Group Co., LTD.

International Academy of Computing Technology

2024 the 9th International Conference on Advances in Electronics Engineering (ICAEE 2024) aims to provide a forum for researchers, practitioners, and professionals from the industry, academia and government to discourse on research and development, professional practice in electronics engineering. ICAEE 2024 will be held in Chengdu, China during October 18-20, 2024.

Email.: Dunn@iact.net

Electronics and Communications Engineering; Telecommunication Services and Applications; Wireless Networking; Microwave Engineering; Antennas - Design, Modeling and Measurement; Optoelectronic Engineering; Optoelectronics;

YOUNG

2024 IEEE 24th International Conference on Communication Technology (IEEE ICCT 2024) will be held in Chengdu, China during October 18-20, 2024. It's co-sponsored by IEEE Beijing Section and UESTC, technically sponsored by IEEE Chengdu Section, organized by National Key Laboratory of Wireless Communications, and co-organized by Hong Kong University of Science and Technology (Guangzhou).

Email.: saraxc17@163.com

Communication and Information Theory Symposium; Signal Processing for Communications Symposium; Integrated Sensing and Communication Symposium; Semantic Communications Symposium; AI for Communications and Networks Symposium; Cloud and Edge Computing Symposium;

Phased array systems continue to be a rapidly evolving technology with steady advances motivated by the challenges presented to modern military and commercial applications. This symposium will present the most recent advances in phased array technology and offer a unique opportunity for members of the international community to interact with colleagues in the field of phased array systems and technology.

Métrologie et instrumentation,    Opto-électronique et technique d'affichage

WEKA Fachmedien GmbH

Der Wechsel von einer vier- oder achtadrigen Verkabelung auf eine zweiadrige Verkabelung ist ein großer technischer Fortschritt: Mit Single Pair Ethernet lassen sich Platz, Gewicht und Installationsaufwand reduzieren, Kosten senken und Rohmaterialien wie Kupfer einsparen. Noch wichtiger aber ist, dass sich auf einfache Weise eine durchgängige Kommunikation bis hin zu den kleinsten Geräten realisieren lässt! Es entsteht die digitale Infrastruktur von morgen. Für Anwendungen in der Automatisierung, der Gebäudeautomation und dem Transportwesen stehen die entsprechenden Komponenten zum Einsatz bereit; jetzt beginnt die spannende Phase der Implementierung! Was müssen Entscheider wissen? Wie wird aus Theorie nun Praxis? Das 3. Forum Single Pair Ethernet bietet eine anwendungsübergreifende Plattform, um die Technologie ganzheitlich zu verstehen – von der Komponente bis zum System.

Réseaux, Internet,    Matériel informatique

Électrotechnique,    Ingénierie et l'industrie (en général)

WEKA FACHMEDIEN GMBH

Legacy technologies, like Bluetooth and Wi-Fi have seen many innovations and iterations. Fundamentally new technologies like Narrowband IoT/5G or Low-Power Wide Area Networks (LPWAN) have found rapid acceptance in the markets. Today preparation for 6G mobile networks is in full swing. With the 21st congress program, we will continue to provide information on novel wireless technologies and applications. We are very much looking forward to your interesting submission and to meeting you in Munich at the Wireless Congress: Systems & Applications on November 13th and 14th, 2024 in Munich, Germany – parallel to electronica!

Matériel informatique,    Informatique mobile & télécommunications

Abdus Salam International Centre for Theoretical Physics (ICTP), Trieste, Italy

Matériel informatique,    Génie logiciel

International Academy of Computing Technology

2024 7th International Conference on Electronics and Communication Engineering (ICECE2024) will take place in Xi'an, China from December 6th to 8th, 2024, and is mainly sponsored by Xi'an University of Technology.

Email.: Dunn@iact.net

Computer Science; Electronics and Communication; Broadcasting Technology; Multimedia Networking;

IEEE PEDES 2024 will be held at National Institute of Technology Karnataka (NITK) Surathkal, Mangaluru from 18th -21st December 2024. IEEE PEDES is a biennial conference sponsored by IEEE Industry Applications Society and technically co-sponsored by IEEE Power Electronics Society, Industrial Electronics Society, and Power & Energy Society. The goal of PEDES is to provide a platform for conference, exhibition and tutorial on selected topics of contemporary interest. The conference provides a unique forum for the exchange of knowledge and information among the professionals across the globe in the area of power electronics, drives and energy system subjects which have greater significance owing to the emphasis on energy affected by the climate change. The conference aims at bringing together the users and researchers of electrical energy conversion systems and sub-systems with the emphasis on technical content of the papers.

ASP-DAC is the largest conference in Asia and South-Pacific regions on Electronic Design Automation (EDA) area for VLSI and systems. ASP-DAC has been started at 1995 and this ASP-DAC 2025 is 30th conference. ASP-DAC 2025 offers you an ideal opportunity to touch the recent technologies and the future directions on the LSI design and design automation areas by technical papers and tutorials. ASP-DAC also holds Designers' Forum to make presentations about the latest designs for designers.

Microtechnologie, nanotechnologie,    Matériel informatique

IEEE

IEEE

The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts

APEC is the leading conference for practicing power electronics professionals and addresses a broad range of topics in the use, design, manufacture and marketing of all kinds of power electronics equipment.

WEKA FACHMEDIEN GMBH

Signal Processing Society

ICASSP is the world’s largest and most comprehensive technical conference focused on signal processing and its applications. It offers a comprehensive technical program presenting all the latest development in research and technology in the industry that attracts thousands of professionals annually.

Email.: jayson.gilbert@ieee.org

signal processing

CZESND

It is co-sponsored by Sichuan Institute of Electronics and IEEE, technically co-sponsored by Chengdu Section, Chengdu Section AP/EMC Chapter, Chengdu Section SP Chapter, IEEE Chengdu Section SSC/CAS Joint Chapter, Sichuan Institute of Electronics, hosted by Youth Talent Work Committee of Sichuan Institute of Electronics, also with the support of University of Electronic Science and Technology of China, Sichuan University, Southwest Jiaotong University, Xi’an University of Technology, Singapore Institute of Electronics, Chengdu University of Technology, Chengdu University of Information Technology, etc.

Email.: Nazal@sina.com

Antennas and Microwaves; Electronics Materials and Devices; Communication and Networks; Power and Electrical Engineering; Aerospace & Electronics Systems; Electronics Applications; Internet of Things; Embedded System; AI and Applications; Control and Robotics; Signal Processing;

Électrotechnique,    L'Internet des objets (IoT) et réseau de capteurs

Électrotechnique,    Génie mécanique

IEEE Industrial Electronics Society

Électrotechnique,    Génie mécanique

Matériel informatique,    Salons, foire-exposition

IEEE Industrial Electronics Society

Électrotechnique,    Ingénierie et l'industrie (en général)

IEEE

The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts

The Applied Power Electronics Conference (APEC) focuses on the practical and applied aspects of the power electronics business. This is not just a designer’s conference; APEC has something of interest for anyone involved in power electronics

Électrotechnique,    Salons, foire-exposition

IEEE

The Applied Power Electronics Conference (APEC) focuses on the practical and applied aspects of the power electronics business. This is not just a designer’s conference; APEC has something of interest for anyone involved in power electronics

Électrotechnique,    Salons, foire-exposition

IEEE

The Applied Power Electronics Conference (APEC) focuses on the practical and applied aspects of the power electronics business. This is not just a designer’s conference; APEC has something of interest for anyone involved in power electronics

Électrotechnique,    Salons, foire-exposition