Conférences - Électronique

Microsystems Technology Laboratories (MTL)

The Microsystems Annual Research Conference (MARC) is a long-running event celebrating the scientific achievements of students and staff pursuing research at the frontiers of micro/nanotechnology at MIT. Tracing its roots to the semesterly VLSI Research Reviews of the mid-80s, over the years, MARC has evolved into a student-run conference that hosts over 200 attendees, bringing together students, postdocs, faculty, and industrial partners. For the first time, this year, MARC will be co-hosted by MTL and MIT.Nano!

Microtechnologie, nanotechnologie,    Semi-conducteurs

NAVAIR, PMA-209

Showcase of never-before-seen developments in the growing open market ecosystem. Live demonstrations on Systems Acquisition and Integration, Module Specification and Development, Conformance (qualification) and Open Systems Realization. Find out exactly how the new maturity of modular open systems approach technology will greatly increase defense program efficiency, accelerate the acquisition of the latest capabilities, and improve adaptability in currently fielded systems.

Tél.: [5037058651];     Email.: sally@sallybixby.com

technology, hardware, software, modularopensystems, sosa, cmoss,

Salons, foire-exposition,    Génie logiciel

Haus der Technik e.V.

Das Seminar vermittelt die notwendigen Grundlagen der Elektromagnetischen Verträglichkeit von Schaltnetzteilen anhand von Bauelementen, Schaltungen und deren Betriebsarten. Der Schwerpunkt liegt im EMV-gerechten Entwurf mit vielen Beispielen.

Haus der Technik c/o IMOS GmbH, Weißenburger Str.3, 93055 Regensburg;     Tél.: (0) 201/18 03-312;     Email.: h.reff@hdt.de

Elektromagnetische Verträglichkeit, EMV, EMV-Eigenschaften, EMV-gerecht, EMV-Gesetz, EMV-konform, EMV-Maßnahmen, EMV-Problem, EMV Schaltnetzteil, EMV-gerechtes Design, EMV-gerechter Entwurf, Magnetische Bauelemente, Leistungshalbleiter, Gleichstromsteller, Kopplung, EMV-Filter, EMV-gerechtes Layout, Schaltnetzteile, EMV Phänomen

SPIE Photonics West is the world's largest photonics technologies event. Over 22,000 people attend Photonics West each year to learn, connect, and find the latest research and products. Topics cover biomedical optics, biophotonics, lasers, industrial lasers, optoelectronics, microfabrication, MOEMS-MEMS, displays, and more. Six days, two exhibitions, 1,450 companies, 5,200 papers, networking events, industry sessions, courses, and a co-located AR, VR, MR conference make this the most important annual event in the optics and photonics market—and the industries they enable.

Customer Service;     Tél.: [+1 360 676 3290];     Email.: customerservice@spie.org

photonic, call for papers, photonics, spectroscopy, spie photonics west, photonics west, laser technology, photonic crystals, spie photonic west, photonic conference, nonlinear optics, neurosurgery conference, laser sources, photonics conferences, quantum applications, ultrafast optics, neurophotonics, photonic technology, biomedical optics, biomedical imaging

Optique et lasers,    Opto-électronique et technique d'affichage

ISSCC is the foremost global forum for solid-state circuits and systems-on-a-chip. The Conference offers 5 days of technical papers and educational events related to integrated circuits, including analog, digital, data converters, memory, RF, communications, imagers, medical and MEMS ICs.

Haus der Technik e.V.

Neben dem physikalischen Verhalten und der Erkenntnis, wann eine Baugruppe „High-Speed“ ist, erfährt der Teilnehmer mehr zu den schnellen Änderungen von Schaltzuständen und deren Auswirkungen auf die Leiterplatte.

Haus der Technik c/o IMOS GmbH, Weißenburger Str.3, 93055 Regensburg;     Tél.: (0) 201/18 03-312;     Email.: h.reff@hdt.de

High Speed Design, High Speed Baugruppen, Leiterplattendesign, Leiterbahnen, Schaltungsdesign, Schaltungslayout, Taktfrequenz, Digitalsignal, Induktivität, Signalreflexion, Übersprechen, Interferenz, Impedanz, BGA, Microvia; EMC, EMV, Elektromagnetische Verträglichkeit, EMV-Simulation, Störfestigkeit

Matériel informatique,    Semi-conducteurs

Electrical Engineering Academic Association of Thailand (EEAAT)

The 2020 International Electrical Engineering Congress (iEECON2020) is a premier international academic conference organized by the Electrical Engineering Academic Association of Thailand (EEAAT). The iEECON2020 will provide a forum for researchers, engineers and industry experts to discuss recent developments, new ideas and breakthroughs in Electrical Engineering technologies.

power & energy, communications, electronics & control, digital signal processing, and computer & IT

GOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC, and provides a forum for government reviews.

Microelectronics for a New Decade: Global Competition and Near-Peer Challenges

ACM - Association for Computing Machinery

The ACM sponsored TAU series of workshops provide an informal forum for practitioners and researchers working on temporal aspects of digital systems to disseminate early work and engage in a free discussion of ideas. The twenty-seventh in the TAU series, and on its 30th anniversary, the TAU 2020 workshop emphasizes novel aspects of timing and power analysis as well as optimization with special invited talks. TAU also organizes a student contest each year, this year the contest topic is "Delay calculation using current models". More details can be found on the TAU website (www.tauworkshop.com)

General Chair;     Tél.: [+1 978 502 0825];     Email.: joao.geada@ansys.com

static timing analysis, statistical timing analysis, design optimization, power optimization, variability, clock design, library characterization

Semi-conducteurs ,    Algorithmes

On behalf of the Organizing Committees and Industrial Electronics Society of the IEEE, it is our pleasure to welcome you to the IEEE International Workshop on Advanced Motion Control (AMC2020) that will be held on April 20-22, 2020, at the University of Agder, Campus Kristiansand, in Norway. Following to the last AMC2018 in Tokyo, Japan, our wish is to continue bringing together the researchers from both academia and industry and to maintain a highest scientific conference level, with enriching meetings and discussions and interesting and memorable events and experiences.

Électrotechnique,    Robotique, automation & mécatronique

National Oceanic and Atmospheric Administration

The conference addresses the remarkably diverse impacts of space weather on today's technology. The program highlights space weather impacts in several areas, including communications, navigation, spacecraft operations, aviation, and electric power. The workshop will also focus on the highest priority needs for operational services that can guide future research and new high-value capabilities that can be transitioned into operations. The conference fosters communication among researchers, space weather service providers, and users of space weather services.

Météorologie et les changements climatiques,    Électrostatique et rayonnement électromagnétique

The Institution of Engineering and Technology.

Électrotechnique,    Génie mécanique

Haus der Technik e.V.

Welche Materialien und Technologien stehen beim Entwurf moderner Leiterplatten zur Verfügung und welchen Einfluss üben sie und die ausgewählten Aufbauvarianten auf die Kosten aus? Antworten auf diese und weitere aktuelle Fragen gibt das Seminar.

Haus der Technik c/o IMOS GmbH, Weißenburger Str.3, 93055 Regensburg;     Tél.: (0) 201/18 03-312;     Email.: h.reff@hdt.de

Elektronikentwicklung, Leiterplatten, PCB, FR4, Schaltungsdesign, Schaltungslayout, IPC 4101, CAF, Stromlaufplan, Massekonzept, Elektromagnetische Einflüsse, Elektromagnetische Verträglichkeit, Elektromobilität, Elektromotor, Elektronik, Elektronikfertigung, Elektronik/Grundlagen, Elektronikindustrie, Elektronik/Kfz, Elektronikwerkstoffe, Elektronische Bauelemente, Elektronische Geräte, Elektronische Komponente, Elektronische Schaltungen, Elektrotechnik, EMV-Maßnahmen, EMV-Messverfahren, EMV-Richtlinie, Fahrzeugelektronik, Halbleiterbauelemente, Kfz-Elektronik, Leiterplattenentwicklung, Leiterplattentechnologien, Löten, Lötverbindungen, Lötverfahren

Asia Pacific Electromagnetic Compatibility Society of Australia

Modern Society is increasingly becoming more connected and the technology that is enabling this to happen is operating in a complex and hostile electromagnetic environment. As such knowledge and practical experience in EMC design, mitigation and testing is increasingly in demand.

Électrostatique et rayonnement électromagnétique,    Électrotechnique

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

Lviv Polytechnic National University, Institute for Telecommunications, Radioelectronics and Electronic Engineering, R&D Center of Solid State Electronics and Sensors, Oxide Crystal Physics Laboratory

Lviv Polytechnic National University (Lviv, Ukraine) will host the sequential 6th International Conference on Oxide Materials for Electronic Engineering – fabrication, properties and application (ОМЕЕ-2020) on May 31 – June 4, 2020 in Lviv – one of the most charming cities of Ukraine. Previous OMEE meetings were carried out in 2017, 2014, 2012, 2009 and 2007. The Conference is devoted to actual problems of modern science and technologies in the field of oxide and related materials and application them in new energy sources, electronic engineering and information technologies, quantum and optoelectronics, sensors, transducers, nanotechnologies, etc.

Conference Secretariat;     Tél.: [+38-032-258-2696];     Email.: omee@lpnu.ua

oxide materials, crystal structure, defects, magnetic materials, nano-composites, nanoparticles, superconductors, electronic engineering, detectors of radiation, biomedical applications, quantum and optoelectronics, transport phenomena, resistivity switching, sensing and catalysis

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

ICEEE

ICEEE Seoul 2020 welcomes all participants throughout the world to attend the International Conference on Electronics & Electrical Engineering held on June 8-10, 2020 in South Korea, Seoul. The main theme of the conference is “Recent Trends and Future Technology in Electrical and Electronics Engineering”.

Tél.: [1-650-835-7727];     Email.: sana_sandy@iceee2020seoul.com

electrical engineering conferences, embedded systems conference, embedded conference, power electronics conference

Électrotechnique,    Réseau électrique et réseau électrique intelligent

Kaunas University of Technology

The 24th International Conference ELECTRONICS 2020 (#electronicsconf) will take place in Palanga, Lithuania from 15th to 17th June, 2020. ELECTRONICS 2020 is organized by Kaunas University of Technology, Department of Electronics Engineering. Representatives from science and study institutions, industry and business are invited for joint discussion to evaluate present situation of ELECTRONICS science and industry, foresee ways for effective implementation of science achievements into industry and to exchange with research results. We cordially invite you to participate and submit your contribution to ELECTRONICS 2020.

Tél.: [+370 37 300519];     Email.: electronics@ktu.lt

Automation, Robotics and Control; Electrical Engineering; Electronic Measurements; Electronics; High Frequency Technology, Microwaves; Nano- / microelectronics; Renewable Energy; Signal Technology; System Engineering, Computer Technologies; Telecommunications Engineering;

Électrotechnique,    Robotique, automation & mécatronique

Haus der Technik e.V.

Im Fokus steht die Erfüllung von EMV-Anforderungen. Sie erfahren mehr zur EMV-gerechten Auslegung von Geräten und Systemen, zur Gehäuseschirmung, zum Verhalten realer EMV-Bauelemente, zum Transientenschutz und zu den Grundlagen wichtiger EMV-Normen.

Haus der Technik c/o IMOS GmbH, Weißenburger Str.3, 93055 Regensburg;     Tél.: (0) 201/18 03-312;     Email.: h.reff@hdt.de

Elektromagnetische Verträglichkeit, EMV, EMV Geräte, EMV Systeme, EMV-Messung, Gehäuseschirmung, Funktionale Sicherheit, EMV-Bauelemente, EMV Schaltung, EMV Schnittstellen, Gerätedesign, EMV-Labor, EMV Gesetz, EMV Norm, Entstörung Geräte, Messung Störaussendung, EMV-Prüfung, Störfestigkeit, EMV-konformes Gerät, EMV-konforme Entwicklung, EMV-Anforderungen, EMV-Eigenschaften, EMV Gesetz, EMV-Gesetz, EMV-Maßnahmen, EMV-Norm, EMV-Normen, EMV-Planung, EMV-Problem, EMV-Richtlinie

International Frequency Sensor Association (IFSA)

The conference is the third of a series of annual International Conferences on Microelectronic Devices and Technologies (MicDAT) held in Barcelona (Spain), 2018 and in Amsterdam (The Netherlands), 2019 organized by IFSA. The MicDAT' 2020 conference is intended to create awareness of the huge potential of modern microelectronic technologies and to improve understanding on the recent challenges in a wide range of applications. The many different technological bases for the fabrication of microelectronic devices, SoC, SiP, MEMS and NEMS will be outlined in this 3-day conference. A number of recognized experts from both: academy and industry in the field of microelectronic design will be invited to give their view in selected application areas. Featuring strong participation of industry and academia, the MicDAT' 2020 conference will provide an excellent opportunity to exchange ideas and present latest advancements in these areas. The aim of MicDAT series of conference is to provide an annual world forum for the presentation and discussion of recent advances in microelectronics, and bring together leading international researchers, engineers and practitioners interested on any of the microelectronics related technologies. The conference will offer plenary and invited talks, contributed oral and poster presentations, special sessions, tutorials, and exhibitions of commercial products. Social and cultural events will also take place to foster networking among the participants in a friendly manner. The conference is coordinated with the IFSA series of conferences, which deal with physics and engineering.

Tél.: [+34696067716];     Email.: syurish@sensorsportal.com

microelectronics, semiconductors, microelectronic devices, nanoelectronics, MEMS, NEMS, microelectronic technology

Microtechnologie, nanotechnologie,    Semi-conducteurs

co-sponsored by the IEEE Electron Device Society and MRS

Materials Research Society (MRS)

The Electronic Materials Conference (EMC) is the premier annual forum on the preparation, characterization and use of electronic materials.

Physique de la matière condensée et des matériaux,    Semi-conducteurs

American Automatic Control Council (AACC)

The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).

Robotique, automation & mécatronique,    Génie mécanique

Haus der Technik e.V.

Neben dem physikalischen Verhalten und der Erkenntnis, wann eine Baugruppe „High-Speed“ ist, erfährt der Teilnehmer mehr zu den schnellen Änderungen von Schaltzuständen und deren Auswirkungen auf die Leiterplatte.

Haus der Technik c/o IMOS GmbH, Weißenburger Str.3, 93055 Regensburg;     Tél.: (0) 201/18 03-312;     Email.: h.reff@hdt.de

High Speed Design, High Speed Baugruppen, Leiterplattendesign, Leiterbahnen, Schaltungsdesign, Schaltungslayout, Taktfrequenz, Digitalsignal, Induktivität, Signalreflexion, Übersprechen, Interferenz, Impedanz, BGA, Microvia; EMC, EMV, Elektromagnetische Verträglichkeit, EMV-Simulation, Störfestigkeit

Dans mon pays , nous voulons apprendre comment faire la stabilité du erseau électrique avec extension

Tél.: [253 77 76 66 70];     Email.: ahmed.salebanhassan1988hotmail.com

8th CIGRE Session 23 aou 2020 - 28 aou 2020 • Paris, France Organisateur: CONSEIL INTERNATIONAL des GRANDS RESEAUX ELECTRIQUES (CIRGE) Identifiant de l'évènement: 1230110 Sujets apparentés: Électrotechnique Page web: https://www.cigre.org/GB/events/cigre-session-2020

Pile électrique,    Réseau électrique et réseau électrique intelligent

This symposium pertains to the field of electromagnetic compatibility.

For more than five decades, ASC has been an important gathering point for the electronics, large scale, and materials fields within the applied superconductivity community. The 2020 theme, “Bringing Horizons into Clear View,” acknowledges the excitement of superconductivity and the predictions made in the past, the long journey many applications have taken to come to fruition, and the promising opportunities yet to come.

Matériaux quantiques, basses températures,    Physique appliquée (en general)

American Automatic Control Council (AACC)

The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).

Robotique, automation & mécatronique,    Génie mécanique

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

American Automatic Control Council (AACC)

The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).

Robotique, automation & mécatronique,    Génie mécanique

American Automatic Control Council (AACC)

The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).

Robotique, automation & mécatronique,    Génie mécanique