Conférences  >  Ingénieries  >  Électronique

The Applied Power Electronics Conference (APEC) focuses on the practical and applied aspects of the power electronics business. This is not just a designer’s conference; APEC has something of interest for anyone involved in power electronics

Électrotechnique,    Salons, foire-exposition

SSPS 2026

Signal processing is an electrical engineering subfield that focuses on analysing, modifying, and synthesizing signals such as sound, images, and scientific measurements. Signal processing techniques can be applied to improve transmission, storage efficiency and subjective quality and to also emphasize or detect components of interest in a measured signal.

Email.: adam@asr.org

Machine Learning for Signal Processing: Deep learning/machine learning/AI algorithms; Tools/platforms for AI; Edge and cloud AI computing platforms; Hardware/neuromorphic accelerators; Hardware/software co-design and automation for AI. Design Methods of Signal Processing Systems: Optimization of signal processing algorithms; Compilers and tools for signal processing systems; Algorithm-to-architecture transformation; Dataflow-based design methodologies; Error-tolerant techniques for signal processing. Signal Processing Application Systems: Audio, speech, and language processing; Biomedical signal processing and bioinformatics; Image, video, and multimedia signal processing; Information forensics, security, and cryptography; Sensing and sensor signal processing; Signal processing for non-volatile memory systems; Latency-and power-constrained signal processing; Wireless communications and MIMO systems; Coding and compression; Signal processing for mixed-signal technologies.

ECV International

This summit centered on the theme "E/E Architecture Innovation in the Age of AI and SDV", will bring together leading global OEMs, Tier 1 suppliers, technology giants, and academic pioneers to explore how next-generation E/E architecture is shaping the foundation of intelligent vehicles; and discuss how AI acts as a central driving force, guiding the next revolution in E/E architecture across computing, communication, power distribution, and hardware-software integration—laying a solid foundation for building more efficient, intelligent, and secure future vehicles.

European Automotive E/E System Summit 2026;     Tél.: [8613271915990];     Email.: britney@ecvinternational.com

Driving Software-Centric Innovation: What’s Next for E/E Architecture From Distributed to Centralized: Architecting the Future of E/E Systems with AI The AI-Driven Automotive Revolution: From Centralized Computing to Autonomous Mobility Unlocking Central Compute Performance: How High-Speed In-Vehicle Networks Power AI-Defined Vehicle Next-Generation E/E Architectures: Scalability, AI Integration & Multi-Path Electrification Towards Gigabit Ethernet in SDV: OEM Challenges in Scaling Bandwidth, Safety and Real-Time Communication Sensor Fusion Architecture: Delivering High-Quality Data for AI Designing the Data Backbone: High-Speed In-Vehicle Networks in Centralized Vehicle Architectures Road to Cloud Mobility: Cross- Domain E/E Architecture Powering in SDV Era Securing SDV: From Embedded Security to Secure Boot and Partitioning

Électrotechnique,    Ingénierie automobile et ferroviaire

MIPRO Croatian Society

The international 49th ICT and Electronics Convention MIPRO 2026 invites authors to submit papers and proposals addressing information and communication technologies, electronics, smart industry, renewable energy sources, ecology, and emerging high technologies.

Email.: mipro@mipro.hr

Artificial Intelligence Systems, Business Intelligence Systems and Big Data Processing, Computers in Education, Cyber and Information Security, Telecommunications & Information, Distributed Computing and Cyber-Physical Systems, Digital Economy and Digital Society, Data Science and Biomedical Engineering, Engineering Education, Human-Computer Interaction, Information and Communication Technology Law, Microelectronics, Electronics and Electronic Technology, Optoelectronics, Photonics, Quantum Optics & Optical Computing, Project Management, Smart Industries and Digital Ecosystems, Software and Systems Engineering

IEEE Chengdu Section

It is our pleasure to extend a warm welcome to all delegates to participate in 2026 9th International Conference on Electronics Technology (ICET) which is yearly held at Chengdu, China. ICET 2026 will be from May 29th to 31st. It is co-sponsored by IEEE Chengdu Section, Sichuan Institute of Electronics, hosted by Youth Talent Work Committee of Sichuan Institute of Electronics, also with the support of University of Electronic Science and Technology of China, Sichuan University, Southwest Jiaotong University, Xi’an University of Technology, Singapore Institute of Electronics, Chengdu University of Technology, Chengdu University of Information Technology, etc.

Tél.: [+86-028-8652-8629];     Email.: nazal@sina.com

Track 1: Antennas and Microwaves Track 2: Electronics Materials and Devices Track 3: Communication and Networks Track 4: Power and Electrical Engineering Track 5: Aerospace & Electronics Systems Track 6: Electronics Applications Track 7: Internet of Things Track 8: Embedded System Track 9: AI and Applications Track 10: Control and Robotics Track 11: Signal Processing Track 12: Advanced Sensors Track 13: Flexible Electronics

Power electronics has been providing numerous new technologies in the fields of electric energy conversion and motor drive systems for more than 50 years. In recent years, global energy and environmental issues are becoming more serious and power electronics is expected to play a key role in solving such problems. Also, the power electronics expands its field to not only Power conversion but also Electric machine and Control. The IPEC Nagasaki 2026 -ECCE Asia- will provide a unique opportunity for international researchers, engineers, and academics to present and exchange the latest information on Integration of Power conversions, Electric machines, and Control (IPEC).

NTNU – Norwegian University of Science and Technology - Center for Quantum Spintronics (QuSpin)

QuSpin´s objective is to develop the basic science that uses quantum entities such as the electron spin as information carriers in radically different ways. We aim at groundbreaking basic research that is crucial to the development of fast, high-capacity, material systems and tools for smaller and more power-efficient electronic devices.

Mécanique quantique et technologie quantique,    Matériel informatique

IEEE

Optica

The Optica Quantum 2.0 Conference and Exhibition brings together the global community driving the next era of quantum technology. Quantum 2.0 harnesses superposition and entanglement in large-scale systems—such as quantum computers, networks and sensors—that move beyond the single-system capabilities of Quantum 1.0. The program spans quantum computing, communications, devices, sensing, and metrology, alongside discussions of the ecosystem, commercialization and societal impact. Attendees will explore cutting-edge research, emerging applications and the opportunities shaping a quantum-enabled future.

Mécanique quantique et technologie quantique,    Matériel informatique

IEEE

The 2026 International Symposium on Industrial Electronics (ISIE) will take place from June 23 to 26, 2026, at WINC AICHI in Nagoya, Japan. ISIE is the flagship annual symposium of the IEEE Industrial Electronics Society (IES). It provides an international platform for researchers, engineers, and industry professionals to share and discuss the latest innovations in areas such as power electronics, intelligent control, renewable energy, robotics, smart manufacturing, communications, and artificial intelligence. We welcome both completed research with new findings and innovative work-in-progress.

Central Queensland University

Welcome to the official website of the 2026 The 19th International Conference on Computer and Electrical Engineering (ICCEE 2026). The conference will be held in Brisbane, Australia on June 24-26,2026, co-sponsored by Central Queensland University and SIE. ICCEE was started in Phuket Island, Thailand in the year of 2008, and after the success of the first edition, it has been held annually from 2009 to 2019 in Dubai(UAE), Chengdu(China), Singapore, Hong Kong, Paris(France), Geneva(Switzerland), Paris(France), Barcelona(Spain), Edmonton(Canada), Tokyo(Japan), TU Delft, Netherlands. According to most authors' willingness, ICCEE2020~2024 were held as a virtual conference. ICCEE2025 was successfully held in Singapore.

Tél.: [+86-199-3832-4931];     Email.: emmaawang2019@sina.com

● Computer Engineering Topic 1: Artificial Intelligence and Machine Learning • Computational and Artificial Intelligence • Algorithm • Pattern Analysis and Recognition • Natural Language Understanding • Computer Vision and Graphics • Image Processing • Generative AI and Large Language Models • Bioinformatics and Biosciences Topic 2:Data Science and Information Systems • Data Management • Data Mining • Mining Data, Text, and the Web • Databases • Web Data Management • Web Information Systems • Information Retrieval Topic 3:Computer Systems and Architecture • Computer Engineering • Computer Architecture • Embedded Systems • Reconfigurable Computing Systems • Operating Systems • Parallel and Distributed Computing • Quantum Computing and Emerging Technologies

Électrotechnique,    Evénement multidisciplinaires ou générales en informatique

European Space Agency (ESA)

SPCD covers a wide range of passive components including capacitors, resistors, connectors, oscillators, inductors, fuses, and thermal sensors, all essential for spacecraft performance. Attendees will explore topics such as application needs, evaluation and qualification methods, lessons learned from past missions, and new developments in materials and manufacturing processes. Moreover, the conference emphasizes standards, procurement strategies, and technology roadmaps that help ensure component quality and supply chain robustness. Presentations include invited and submitted technical papers, poster sessions, and commercial exhibits showcasing cutting-edge innovations.

IEEE

Announcements Paper submission system is now open. Please click here for more information. Special Session submission system is now open. Please click here for more information. Tutorial submission system is now open. Please click here for more information. Conference Overview IEEE IECON is the flagship annual conference of the IEEE Industrial Electronics Society (IES), dedicated to advancing and sharing cutting-edge research, innovative ideas, and emerging developments across a wide spectrum of industrial electronics and related fields.

Power Systems, Power Electronics, Renewable Energy, Smart Cities, Smart Grids, Digital Twins, Robotics and Mechatronics, Cybersecurity, Artificial Intelligence for Industrial Processes, and Industry 5.0.

The Applied Power Electronics Conference (APEC) focuses on the practical and applied aspects of the power electronics business. This is not just a designer’s conference; APEC has something of interest for anyone involved in power electronics

Électrotechnique,    Salons, foire-exposition

IEEE

NTNU – Norwegian University of Science and Technology - Center for Quantum Spintronics (QuSpin)

QuSpin´s objective is to develop the basic science that uses quantum entities such as the electron spin as information carriers in radically different ways. We aim at groundbreaking basic research that is crucial to the development of fast, high-capacity, material systems and tools for smaller and more power-efficient electronic devices.

Mécanique quantique et technologie quantique,    Matériel informatique

The Applied Power Electronics Conference (APEC) focuses on the practical and applied aspects of the power electronics business. This is not just a designer’s conference; APEC has something of interest for anyone involved in power electronics

Électrotechnique,    Salons, foire-exposition