Conférences - Électronique

IHP - Innovations for High Performance Microelectronisc

The Spring School is aimed to provide a comprehensive training, through the lectures of renowned experts, on characterization and modeling of radiation effects and design of radiation hardened electronic circuits and systems. The targeted participants are PhD and MSc students as well as postdocs and researchers from the ELICSIR partners, but also anybody involved in related fields is welcome to attend the event.

Email.: andjelkovic@ihp-microelectronics.com

Spring School, IHP, Innovations, for, high, performance, microelectronics, Leibniz-Institut, für, Innovative, Miktoelektronik, Physics, Materials Science, Computer Sciences, Electrical Engineering, Characterization, Modeling, Radiation Effects, CMOS Technologies, Design, Rad-hard, Circuits, Systems,

On behalf of the Organizing Committees and Industrial Electronics Society of the IEEE, it is our pleasure to welcome you to the IEEE International Workshop on Advanced Motion Control (AMC2020) that will be held on April 20-22, 2020, at the University of Agder, Campus Kristiansand, in Norway. Following to the last AMC2018 in Tokyo, Japan, our wish is to continue bringing together the researchers from both academia and industry and to maintain a highest scientific conference level, with enriching meetings and discussions and interesting and memorable events and experiences.

Électrotechnique,    Robotique, automation & mécatronique

National Oceanic and Atmospheric Administration

The conference addresses the remarkably diverse impacts of space weather on today's technology. The program highlights space weather impacts in several areas, including communications, navigation, spacecraft operations, aviation, and electric power. The workshop will also focus on the highest priority needs for operational services that can guide future research and new high-value capabilities that can be transitioned into operations. The conference fosters communication among researchers, space weather service providers, and users of space weather services.

Météorologie et les changements climatiques,    Électrostatique et rayonnement électromagnétique

The Institution of Engineering and Technology.

Électrotechnique,    Génie mécanique

Haus der Technik e.V.

Welche Materialien und Technologien stehen beim Entwurf moderner Leiterplatten zur Verfügung und welchen Einfluss üben sie und die ausgewählten Aufbauvarianten auf die Kosten aus? Antworten auf diese und weitere aktuelle Fragen gibt das Seminar.

Haus der Technik c/o IMOS GmbH, Weißenburger Str.3, 93055 Regensburg;     Tél.: (0) 201/18 03-312;     Email.: h.reff@hdt.de

Elektronikentwicklung, Leiterplatten, PCB, FR4, Schaltungsdesign, Schaltungslayout, IPC 4101, CAF, Stromlaufplan, Massekonzept, Elektromagnetische Einflüsse, Elektromagnetische Verträglichkeit, Elektromobilität, Elektromotor, Elektronik, Elektronikfertigung, Elektronik/Grundlagen, Elektronikindustrie, Elektronik/Kfz, Elektronikwerkstoffe, Elektronische Bauelemente, Elektronische Geräte, Elektronische Komponente, Elektronische Schaltungen, Elektrotechnik, EMV-Maßnahmen, EMV-Messverfahren, EMV-Richtlinie, Fahrzeugelektronik, Halbleiterbauelemente, Kfz-Elektronik, Leiterplattenentwicklung, Leiterplattentechnologien, Löten, Lötverbindungen, Lötverfahren

King Mongkut’s University of Technology Thonburi, Thailand, Dayeh University, Taiwan, Tribhuvan University, Nepal, and RVS Technical Campus, India

The state-of-the-art image processing research works are dedicated to cover a wide range of computational intelligence techniques with a completely new way of neural networks organization concept called Capsule Networks [CapsNets] that opens up a new era of advanced image-processing applications. It is being organized on May 6-7, 2020 in association with King Mongkut’s University of Technology Thonburi, Thailand, Dayeh University, Taiwan, Tribhuvan University, Nepal, and RVS Technical Campus, India. Moreover, this International Conference on Image Processing and Capsule Networks [ICIPCN 2020] initiates a capsule network perspective to leverage an authoritative and detailed representation to deliver an enhanced image and video recognition and adaptive processing mechanisms which were closely related to the humanistic way of thinking. This extended ICIPCN 2020 conference will be a dedicated platform for researchers, academicians and scholars to share and exchange their valuable research insights, which may clearly define the image and the family of image processing techniques and applications. Henceforth, this premier International conference motivates the researchers to discover more information from images and perform innovative image analysis procedures by efficiently utilizing the evolving capsule network models.

Conference Chair;     Tél.: [+91 6382925489];     Email.: icipcn.conf@gmail.com

Image Processing Image recognition and Analysis Image Registration Image segmentation and edge detection Image texture analysis Medical imaging systems Image acquisition, reconstruction and synthesis Feature Extraction techniques Medical image diagnosis Image reconstructions and losses Medical interpretability and explainable deep learning frameworks Image processing for multispectral images Image enhancement and restoration Image formation principles Pattern recognition and capsule networks in object tracking Face and gesture recognition techniques Capsule based biometric technologies Cognitive vision of image processing Capsule Networks Capsules in image analysis Deep learning in image analysis Pattern recognition Machine Learning Data mining Big data analytics and imaging Visual content analysis Capsule based Fuzzy systems Human-visual systems Robotic vision of image processing Capsules in adaptive image processing Machine learning in capsule neural networks Capsule implementation in image systems Capsules and digital image processing techniques Machine vision-based capsule networks Industrialized capsule networks Artificial intelligence in capsule networks

Evénement multidisciplinaires ou générales en informatique,    Réseaux, Internet

Asia Pacific Electromagnetic Compatibility Society of Australia

Modern Society is increasingly becoming more connected and the technology that is enabling this to happen is operating in a complex and hostile electromagnetic environment. As such knowledge and practical experience in EMC design, mitigation and testing is increasingly in demand.

Électrostatique et rayonnement électromagnétique,    Électrotechnique

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

Lviv Polytechnic National University, Institute for Telecommunications, Radioelectronics and Electronic Engineering, R&D Center of Solid State Electronics and Sensors, Oxide Crystal Physics Laboratory

Lviv Polytechnic National University (Lviv, Ukraine) will host the sequential 6th International Conference on Oxide Materials for Electronic Engineering – fabrication, properties and application (ОМЕЕ-2020) on May 31 – June 4, 2020 in Lviv – one of the most charming cities of Ukraine. Previous OMEE meetings were carried out in 2017, 2014, 2012, 2009 and 2007. The Conference is devoted to actual problems of modern science and technologies in the field of oxide and related materials and application them in new energy sources, electronic engineering and information technologies, quantum and optoelectronics, sensors, transducers, nanotechnologies, etc.

Conference Secretariat;     Tél.: [+38-032-258-2696];     Email.: omee@lpnu.ua

oxide materials, crystal structure, defects, magnetic materials, nano-composites, nanoparticles, superconductors, electronic engineering, detectors of radiation, biomedical applications, quantum and optoelectronics, transport phenomena, resistivity switching, sensing and catalysis

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

ICEEE

ICEEE Seoul 2020 welcomes all participants throughout the world to attend the International Conference on Electronics & Electrical Engineering held on June 8-10, 2020 in South Korea, Seoul. The main theme of the conference is “Recent Trends and Future Technology in Electrical and Electronics Engineering”.

Tél.: [1-650-835-7727];     Email.: sana_sandy@iceee2020seoul.com

electrical engineering conferences, embedded systems conference, embedded conference, power electronics conference

Électrotechnique,    Réseau électrique et réseau électrique intelligent

Kaunas University of Technology

The 24th International Conference ELECTRONICS 2020 (#electronicsconf) will take place in Palanga, Lithuania from 15th to 17th June, 2020. ELECTRONICS 2020 is organized by Kaunas University of Technology, Department of Electronics Engineering. Representatives from science and study institutions, industry and business are invited for joint discussion to evaluate present situation of ELECTRONICS science and industry, foresee ways for effective implementation of science achievements into industry and to exchange with research results. We cordially invite you to participate and submit your contribution to ELECTRONICS 2020.

Tél.: [+370 37 300519];     Email.: electronics@ktu.lt

Automation, Robotics and Control; Electrical Engineering; Electronic Measurements; Electronics; High Frequency Technology, Microwaves; Nano- / microelectronics; Renewable Energy; Signal Technology; System Engineering, Computer Technologies; Telecommunications Engineering;

Électrotechnique,    Robotique, automation & mécatronique

Haus der Technik e.V.

Im Fokus steht die Erfüllung von EMV-Anforderungen. Sie erfahren mehr zur EMV-gerechten Auslegung von Geräten und Systemen, zur Gehäuseschirmung, zum Verhalten realer EMV-Bauelemente, zum Transientenschutz und zu den Grundlagen wichtiger EMV-Normen.

Haus der Technik c/o IMOS GmbH, Weißenburger Str.3, 93055 Regensburg;     Tél.: (0) 201/18 03-312;     Email.: h.reff@hdt.de

Elektromagnetische Verträglichkeit, EMV, EMV Geräte, EMV Systeme, EMV-Messung, Gehäuseschirmung, Funktionale Sicherheit, EMV-Bauelemente, EMV Schaltung, EMV Schnittstellen, Gerätedesign, EMV-Labor, EMV Gesetz, EMV Norm, Entstörung Geräte, Messung Störaussendung, EMV-Prüfung, Störfestigkeit, EMV-konformes Gerät, EMV-konforme Entwicklung, EMV-Anforderungen, EMV-Eigenschaften, EMV Gesetz, EMV-Gesetz, EMV-Maßnahmen, EMV-Norm, EMV-Normen, EMV-Planung, EMV-Problem, EMV-Richtlinie

International Frequency Sensor Association (IFSA)

The conference is the third of a series of annual International Conferences on Microelectronic Devices and Technologies (MicDAT) held in Barcelona (Spain), 2018 and in Amsterdam (The Netherlands), 2019 organized by IFSA. The MicDAT' 2020 conference is intended to create awareness of the huge potential of modern microelectronic technologies and to improve understanding on the recent challenges in a wide range of applications. The many different technological bases for the fabrication of microelectronic devices, SoC, SiP, MEMS and NEMS will be outlined in this 3-day conference. A number of recognized experts from both: academy and industry in the field of microelectronic design will be invited to give their view in selected application areas. Featuring strong participation of industry and academia, the MicDAT' 2020 conference will provide an excellent opportunity to exchange ideas and present latest advancements in these areas. The aim of MicDAT series of conference is to provide an annual world forum for the presentation and discussion of recent advances in microelectronics, and bring together leading international researchers, engineers and practitioners interested on any of the microelectronics related technologies. The conference will offer plenary and invited talks, contributed oral and poster presentations, special sessions, tutorials, and exhibitions of commercial products. Social and cultural events will also take place to foster networking among the participants in a friendly manner. The conference is coordinated with the IFSA series of conferences, which deal with physics and engineering.

Tél.: [+34696067716];     Email.: syurish@sensorsportal.com

microelectronics, semiconductors, microelectronic devices, nanoelectronics, MEMS, NEMS, microelectronic technology

Microtechnologie, nanotechnologie,    Semi-conducteurs

co-sponsored by the IEEE Electron Device Society and MRS

Materials Research Society (MRS)

The Electronic Materials Conference (EMC) is the premier annual forum on the preparation, characterization and use of electronic materials.

Physique de la matière condensée et des matériaux,    Semi-conducteurs

American Automatic Control Council (AACC)

The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).

Robotique, automation & mécatronique,    Génie mécanique

Haus der Technik e.V.

Neben dem physikalischen Verhalten und der Erkenntnis, wann eine Baugruppe „High-Speed“ ist, erfährt der Teilnehmer mehr zu den schnellen Änderungen von Schaltzuständen und deren Auswirkungen auf die Leiterplatte.

Haus der Technik c/o IMOS GmbH, Weißenburger Str.3, 93055 Regensburg;     Tél.: (0) 201/18 03-312;     Email.: h.reff@hdt.de

High Speed Design, High Speed Baugruppen, Leiterplattendesign, Leiterbahnen, Schaltungsdesign, Schaltungslayout, Taktfrequenz, Digitalsignal, Induktivität, Signalreflexion, Übersprechen, Interferenz, Impedanz, BGA, Microvia; EMC, EMV, Elektromagnetische Verträglichkeit, EMV-Simulation, Störfestigkeit

Dans mon pays , nous voulons apprendre comment faire la stabilité du erseau électrique avec extension

Tél.: [253 77 76 66 70];     Email.: ahmed.salebanhassan1988hotmail.com

8th CIGRE Session 23 aou 2020 - 28 aou 2020 • Paris, France Organisateur: CONSEIL INTERNATIONAL des GRANDS RESEAUX ELECTRIQUES (CIRGE) Identifiant de l'évènement: 1230110 Sujets apparentés: Électrotechnique Page web: https://www.cigre.org/GB/events/cigre-session-2020

Pile électrique,    Réseau électrique et réseau électrique intelligent

This symposium pertains to the field of electromagnetic compatibility.

For more than five decades, ASC has been an important gathering point for the electronics, large scale, and materials fields within the applied superconductivity community. The 2020 theme, “Bringing Horizons into Clear View,” acknowledges the excitement of superconductivity and the predictions made in the past, the long journey many applications have taken to come to fruition, and the promising opportunities yet to come.

Matériaux quantiques, basses températures,    Physique appliquée (en general)

Guangdong Grandeur International Exhibition Group

We are very pleased to announce that Guangzhou International Solar Photovoltaic Exhibition (PV Guangzhou) has officially renamed Solar PV World Expo（PV Guangzhou). With a brand new name, the show is getting off to a strong fresh start in 2020 too! Solar PV World Expo ( PV Guangzhou) is South China's biggest solar PV exhibition, which has been held for 11 years. The event is expected to cover 40,000 sq.m show floor at China Import & Export Fair Complex this year. Many well-known photovoltaic enterprises have participated in our exhibition for many times, like JA Solar, Mibet, Hanergy, LU’AN Solar, Growatt, Solis, NPP Power, 3Hz-Solar, Moodoo Electronic, Sunte Solar, Density New Energy, Amerisolar, and so on.

Tél.: [02029188152];     Email.: marketing1@grandeurhk.com

PV Guangzhou, pv show, pv fair, production equipment, PV panels, inverters, controllers,  PV application, PV brackets, mobile supplies and accessories, etc.

Salons, foire-exposition,    Réseau électrique et réseau électrique intelligent

Smart Grid Observer

Organized by the Smart Grid Observer, the EV Charging Infrastructure Summit - North America, November 12-13, 2020 in Chicago, convenes top industry experts and utility professionals to examine how growing EV adoption rates will impact the network, and what investments are needed to ensure grid stability and benefit. Case studies of current utility programs and deployments will be discussed with an eye toward refining strategies, identifying technologies, and implementing business models that will ensure widespread EV adoption is optimized for all parties involved.

Tél.: [8153103343];     Email.: daniel.coran@smartgridobserver.com

EV technology, Battery advances, EV charging networks

Électrotechnique,    Réseau électrique et réseau électrique intelligent

American Automatic Control Council (AACC)

The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).

Robotique, automation & mécatronique,    Génie mécanique

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

American Automatic Control Council (AACC)

The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).

Robotique, automation & mécatronique,    Génie mécanique

American Automatic Control Council (AACC)

The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).

Robotique, automation & mécatronique,    Génie mécanique