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ECV International

This summit centered on the theme "E/E Architecture Innovation in the Age of AI and SDV", will bring together leading global OEMs, Tier 1 suppliers, technology giants, and academic pioneers to explore how next-generation E/E architecture is shaping the foundation of intelligent vehicles; and discuss how AI acts as a central driving force, guiding the next revolution in E/E architecture across computing, communication, power distribution, and hardware-software integration—laying a solid foundation for building more efficient, intelligent, and secure future vehicles.

European Automotive E/E System Summit 2026;     Tel.: [8613271915990];     Email: britney@ecvinternational.com

Driving Software-Centric Innovation: What’s Next for E/E Architecture From Distributed to Centralized: Architecting the Future of E/E Systems with AI The AI-Driven Automotive Revolution: From Centralized Computing to Autonomous Mobility Unlocking Central Compute Performance: How High-Speed In-Vehicle Networks Power AI-Defined Vehicle Next-Generation E/E Architectures: Scalability, AI Integration & Multi-Path Electrification Towards Gigabit Ethernet in SDV: OEM Challenges in Scaling Bandwidth, Safety and Real-Time Communication Sensor Fusion Architecture: Delivering High-Quality Data for AI Designing the Data Backbone: High-Speed In-Vehicle Networks in Centralized Vehicle Architectures Road to Cloud Mobility: Cross- Domain E/E Architecture Powering in SDV Era Securing SDV: From Embedded Security to Secure Boot and Partitioning

Elektronik,    Fahrzeugbau. Strassennetz und Eisenbahn

MicroConsult Academy GmbH and ELEKTRONIKPRAXIS

Embedded software engineering is one of the key issues of modern software development. Growing complexity as well as time and cost pressure entail stringent requirements that can only be met with systematic engineering approaches and state-of-the-art informatics and electronics development techniques. Embedded Software Engineering Kongress is the only German-language convention with an exclusive and extensive focus on the manifold issues and challenges with respect to the development of device and system software for industrial applications, automotive engineering, automation, drives, measurement systems, communication systems as well as consumer electronics and medical devices.

Tel.: [+49 (0) 89 450617-71];     Email: ese@microconsult.de

Embedded, embedded systems, embedded software, software development, device software, system software

Eingebettete Systeme, RFIDs,    Softwareentwicklung