Conferences and Meetings on Electronic Engineering

SPIE - The International Society for Optics and Photonics.

Optics and photonics are enabling technologies that are part of our daily lives—from energy efficiency to healthcare. Advancements in these areas will help us to better respond to social and environmental challenges of our future. Its these advancements that will be highlighted at the SPIE Optics + Photonics conference this August in San Diego, California. The conference topics include this year within the areas of nanoscience, organic photonics, optical engineering and applications, and astronomical instrumentation.

With more than 55 conferences, over 3,000 technical presentations, 30 courses, 4,000 attendees, and 150 exhibiting companies, SPIE Optics + Photonics offers both classic and cutting-edge optics and photonics research, training, and product information. Join your peers at SPIE Optics + Photonics 2021 – and get the kind of technical information, professional training, hardware and market intelligence that is key to success in today's changing job and technology landscape. SPIE Optics + Photonics is the largest international, multidisciplinary optical sciences and technology meeting in North America. With three symposia, find the latest research in these four areas: Optical Engineering + Applications, NanoScience + Engineering, and Organic Photonics + Electronics.

Customer Service;     Phone: [360-676-3290];     Email: customerservices@spie.org

remote sensing, data processing, image processing, signal processing, sustainable energy, optical engineering, optical imaging, particle accelerators, optical design, optical manufacturing, physical chemistry, plasmonics, nanoscience, metamaterials, quantum materials, nanomedicine, spintronics, nanoengineering, quantum technology, liquid crystals, quantum imaging, organic electronics, molecular machines, biosensing, women in renewable energy, organic field-effect transistors, perovskite photovoltaics, molecular machines

Optics and Lasers,    Photonics, Optoelectronics and Display Devices

Hindusthan Institute of Technology, Coimbatore, India

In this contemporary era of Informatics, electronics, and communication technologies it has always been critical to develop a more sustainable electronics and communication systems to meet the increasing technological demands. To effectively maintain a sustainable environment and communication technologies, it is always required to meet the quality of service requirements of the emerging smart ICT applications. Nevertheless there are many challenges in reducing the energy consumption of the emerging digital electronics and wireless communication networks. In this perspective, this 2nd International Conference on Electronics and Sustainable Communication Systems (ICESC 2021) held at Hindustan Institute of Technology, Coimbatore, India on 04-06 August, 2021 brings together the state-of-the-art research works to propose novel architectures, models, and algorithms for solving the emerging challenges in almost all the areas of sustainable electronics and communication technologies.

Phone: [8870489968];     Email: icescsconf@gmail.com

ELECTRONICS Modern Electronic Systems and Devices Bio-Inspired Circuits and Systems Digital Circuits and Systems Power System and Its Automation Intelligent Control Systems Semiconductor Devices Micro and Nano Engineering Applied Electronics Bio-Inspired Circuits and Systems VLSI Systems and Its Applications Robotics and Automation Systems Hybrid Power Systems Photonics and Opto Electronics MEMS and Nano Electronic Devices Smart Electronic Materials COMMUNICATION SYSTEMS Ad hoc Networks Antenna and Wave Propagation Biosensors Microwave Communication Digital Communication Systems Mobile Communication Systems Future Wireless Internet Cooperative communication frameworks Wireless sensor networks Smart Grid Communications Next-Generation Networking techniques Communication Modeling, QoS and Reliability COMPUTING Cloud Computing Nature-Inspired Computing Techniques Sustainable Computing Models and Applications Service-Oriented Computing and Applications Parallel and Distributed Computing Machine Learning and Computing Evolutionary Computing Emotional Intelligence Mobile Computing Artificial Intelligence High Performance Computing Distributed Computing Cyber-Physical Systems

GURU NANAK INSTITUTIONS TECHNICAL CAMPUS

9th International Conference on "Innovations in Electronics and Communication Engineering (ICIECE-2021)” aims to provide an opportunity for researchers, scientists, technocrats, academicians and engineers to exchange their innovative ideas and research findings in the field of Electronics and Communication Engineering. The conference will provide interactive platform for the participants and other delegates from the academic and industry segments across India and globe to share their research experience, experiment break through or vision-trends. The first seven editions of this conference: ICIECE - 2012, 2013, 2014, 2015, 2016, 2017, 2018 and 2019 were successfully conducted with more than 2000 delegates from India and abroad. Selected papers of last three editions ICIECE-2019, 2018, 2017 and 2016) are published by Springer Lecture notes. In addition to large number of research papers received from India, huge number of research papers were also received from across the global including USA, UK, Canada, Saudi Arabia, Australia, Malaysia, Japan, Germany, Ethiopia, Bangladesh and many more.

Phone: [9999254432];     Email: iciece@gniindia.org

ANTENNA / MICROWAVE BIOMEDICAL ELECTRONICS VLSI EMBEDDED SYSTEMS INTERNET OF THINGS (IoT)

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The Benelux RF Conference brings together Belgian and Dutch high-tech professionals and companies involved in the development and application of high-end RF techniques.

Events;     Phone: [+31243505544];     Email: events@techwatch.nl

RF Power, RF Energy, RF Techniques, engineers, team leaders, technical managers, product developers, innovation managers

Kongunadu College of Engineering and Technology

Smart Electronics and Communication Technology is essential and instrumental to reality in the today's context of technology driven world. In particular, these technologies leverage unheard innovative and creative opportunities to improve our quality of life. The increasing coverage of Electrical, electronics and communication technologies is driven by growth and to integrate, analyze, visualize and transform new novel engineering ideas. This International Conference on Smart Electronics and Communication (ICOSEC 2021) organized on 07-09 October, 2021 by Kongunadu College of Engineering and Technology, Trichy is solely dedicated to create a conceivable platform for researchers, academician and scientists to interact and exchange the research ideas and results to develop a cost-effective and scalable Smart Electronics and Communication methods into existence.

Phone: [6382925489];     Email: icsec.conf@gmail.com

SMART ELECTRONICS: Analog and Digital Circuits, Antenna Design and RF Propagation, Microwaves Circuits Design, Smart Energy Systems, Nano Electronics and Microelectronics Micro Processor, Electrical Machines and Drive Systems, Electric Vehicle Technologies, Low Power Electronics, Embedded Systems, Signal and Image Processing and Cryptography, Robotics and Automation, VLSI for DSP, Nano-Fabrication & Computing, Semiconductor Technology, Materials for Electronics, Humanoid Robots, Filters and Data Conversion Circuits, Digital Circuits, Mixed Signal Circuits, Adaptive Signal Processing, ASIC & SOC, CAD for VLSI, Antenna Systems, MEMS and Sensors Design, Electronic System Level Design. COMMUNICATION TECHNOLOGIES: Information and Communication Technologies, Cooperative Communications, Wireless Networks, Sensing and Sensor Networks, Internet Technology & Applications, Cyber-Physical Systems for Sustainable Computing, Mobile Computing and Communication, Smart City Technologies and Systems, Information and Data Processing, Artificial Intelligence and Neural Networks, Optical Communication and Components, Communication Theory and Information Theory, Wired/Wireless Technology Integration, Digital Forensics, Internet of Things, Big Data and Data Mining, Green Pervasive Computing, Mobile Social Networking, Fuzzy, Neural and Evolutionary Computation, Edge and Fog Computing, Smart Security Models and Applications, Wearable Systems and Technologies.

European Microwave Association (EuMA)

Engineering (general),    Electrical Engineering

YOUNG-nd

The previous 5 editions ICICM were sponsored by IEEE and it has been successfully held in Chengdu on November 23-25, 2016; in Nanjing on November 8-11, 2017; in Shanghai on November 24-26, 2018; in Beijing on October 25-27,2019 and in Nanjing on October 23-25, 2020. It's really a pity that we can not meet in person due to COVID-19 in 2020, so 2021 The 6th International Conference on Integrated Circuits and Microsystems (ICICM 2021) will still be held in Nanjing,China on October 22-24, 2021 with the support from University of Electronic Science and Technology of China and Southeast University, China.

Phone: [+86-28-87777577];     Email: emmaawang2019@sina.com

Digital, Analog, Mixed Signal IC and SOC design technology; Silicon integrated circuits and manufacturing; Low-power, RF devices & circuits; IC Computer-Aided –Design technology, DFM; Silicon/germanium devices and device physics; Interconnect, Low K, High K and other process technologies; Unconventional and nano-electronics; Organic semiconductor devices and technologies; Compound semiconductor devices and circuits; Displays, sensors and MEMS; Semiconductor materials and material characterization; Packaging and testing technology; Solar cell & other devices for new energy sources; Modeling and simulation; Equipment technology; Reliability; Displays, sensors and MEMS

The American Society of Mechanical Engineers (ASME)

InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD).

InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles.

Plastics, Paints and Synthetic Materials,    Microtechnology, Nanotechnology

PPG Institute of Technology, Coimbatore, India

The 3rd International Conference on Communication, Computing and Electronics Systems (ICCCES 2021) on 28-29, October 2021 is innovative program that primarily focuses on recent advances in the research and development of electronics and computing with a particular focus on their significant role in elevating the innovations in digital engineering level. ICCCES 2021 aims to bring together the leading academicians, researchers, industrialists and research scholars to exchange and share their research ideas and results about all aspect of electronics, computing and communication systems. The conference also aims to provide an unprecedented interdisciplinary platform for scientist, engineers and researchers in the domain of interest to present their latest research ideas, developments, practical applications and results in all areas of computing, electronics and communication systems.

Phone: [8870489968];     Email: iccces2019@gmail.com

Electronics Systems ❖ Virtual Reality ❖ Robotics ❖ Automation Systems ❖ Micro Electronics ❖ Semiconductor Devices ❖ Opto Electronics ❖ Computer and Control Systems ❖ Wavelets & Applications ❖ Multi Carrier Modulation ❖ MIMO Systems ❖ Electromagnetics Engineering ❖ RF Circuit Design Communication Systems ❖ Data Communication and Computer Networking ❖ Cryptography Applications ❖ High Speed Networks ❖ Mobile Networks & Wireless LAN ❖ Optical Networking ❖ Network Based Applications ❖ Network Security ❖ Internet of Things ❖ Next Generation Web Applications ❖ Recent Trends in Computer Networks ❖ Wireless Sensor and Adhoc Network ❖ Intrusion Detection/Prevention Techniques Computing and Application ❖ Artificial Intelligence ❖ Big Data Analysis, Security Issues in Big Data ❖ Cloud / Grid / Distributed Computing ❖ Cognitive Science ❖ Data & Knowledge Engineering ❖ Evolutionary Optimization ❖ Information Theoretic Learning ❖ Sustainable Computing ❖ Human-Computer Interaction ❖ Recent Trends in Software Engineering

ICCS 2021 is sponsored by IEEE, hosted by University of Electronic Science and Technology of China.

ICCS is an international networking platform for researchers in the highly active fields of theory, design and implementation of circuits and systems, to listen, learn and discuss about the most recent scientific and industrial developments and advancements in the area, to identify new issues, and to shape future directions for research. It is a perfect opportunity for PhD candidates to show the progress of their scientific work in front of the conference either as lecture or poster presentations. The congress has the focus on the frontier topics in the theoretical and applied engineering.

Phone: [+86-028-8652-8629];     Email: Nazal@sina.com

Analog signal processing; Analog circuits and filters; Switched capacitor and switched current techniques; Analog and mixed signal processing; Data conversion and sigma-delta modulation; Microsystems and applications; Processor architectures; Deep sub/micron design; Information theory ; Coding and modulation

The IEEE Workshop on Wide Bandgap Power Devices & Applications (WiPDA) provides a forum for device scientists, circuit designers, & application engineers from the Power Electronics & Electron Devices Societies to share technology updates, research findings, experience & potential applications.

Techwatch B.V. - Bits&Chips

The Benelux RF Conference brings together Belgian and Dutch high-tech professionals and companies involved in the development and application of high-end RF techniques.

Events;     Phone: [+31 24 3505544];     Email: events@techwatch.nl

RF Power, RF Energy, engineers, team leaders, technical managers, product developers, innovation managers

the IEEE/IEDM has been the world's main forum for reporting breakthroughs in technology, design, manufacturing, physics and the modeling of semiconductors and other electronic devices. Topics range from deep submicron CMOS transistors and memories to novel displays and imagers, from compound semiconductor materials to nanotechnology devices and architectures, from micromachined devices to smart -power technologies, etc.

International Association of Computer Science and Information Technology

Phone: [+86-18302820449];     Email: aimee@iacsit.net

Acoustic and Vibration Signal Processing; Audio & Acoustic Signal Processing; Biomedical Signal & Image Processing; Biomedical Signal Processing; Communication Signal Processing; Data Processing; Design & Implementation of Signal Processing; Detection and Estimation; Digital Signal Processing; Earth Resources Signal Processing; Filtering; Geophysical and Astrophysical Signal Processing; Graph Theory & Signal Processing; Image Processing; Industrial Applications; Industrial Signal Processing; Machine Learning for Signal Processing; Multi-dimensional Signal Processing;

Welcome to the official website of the 2022 3rd International Conference on Artificial Intelligence in Electronics Engineering (AIEE 2022). The conference will be held in Bangkok, Thailand during January 11-13, 2022.

Phone: [+86-18117808143];     Email: saracms@materials.ac.cn

Artificial Intelligence; AI Algorithms; Biometrics; Computer Vision and Speech Understanding; Computational Theories of Learning; Data and web mining; Artificial Intelligence Tools & Applications; Heuristic and AI Planning Strategies and Tools; Hybrid Intelligent Systems; Evolutionary computation; Ensemble method; Fuzzy Logic; Fuzzy Systems; Neural net and support vector machine;

RIOROB

2022 International Conference on Mechatronics and Electrical Engineering (MEEE 2022) will be held in Prague, Czech Republic during February 18-20, 2022, as the workshop of ICARA 2022.

Phone: [+001(559)-8624927];     Email: riorob@robotics.ac.cn

Advanced Manufacturing; Advanced Motion Control in Mechatronics; Advances in Aerospace and Automotive; Agile Manufacturing; Agriculture, Construction, Industrial Automation, Manufacturing Process; Artificial Intelligence and Intelligent Control; Automation and Control Systems, Middleware; Automotive Control, Autonomous Vehicles, and Electric Vehicles; Biomedical and Rehabilitation Engineering; Computational Modelling and Software Engineering; Machine Learning; Machine Vision; Management of Technology; Manufacturing Process and System;

ETPUB

2022 11th International Conference on Information and Electronics Engineering will be held in Jeju, South Korea, during February 19-21, 2022. ICIEE 2022 is sponsored by Jeju National University with the technical support from Fukuoka Institute of Technology, Tokyo University of Science, CISCO Networking Academy.

Phone: [+86-28-86512185];     Email: helen@academic.net

Information and Communication Engineering; Artificial Intelligence; Bioinformatics; Software Engineering; VLSI Design and Fabrication; Photonic Technologies; Parallel and Distributed Computing; Data Mining; Cryptography; Algorithms and Data Structures; Coding and Signal Processing; Channel Coding; Electronics and Communications Engineering; Applied Electronics; Embedded Systems; Microwave Engineering;

International Academy of Computing Technology

Phone: [+86-18081079313];     Email: Dunn@iact.net

MACHINE LEARNING AND STATISTICAL SIGNAL PROCESSING; Graphical and kernel methods; Tensor Signal Processing; Machine learning and neural networks; IMAGE AND MULTIDIMENSIONAL SIGNAL PROCESSING; Multidimensional signal processing; Image/video coding and transmission; LImage/video analysis, restoration and processing; Image/video storage and retrieval; MULTIMEDIA SIGNAL PROCESSING; Watermarking (Theory, Algorithms, Attacks); Steganography and steganalysis; Hashing for content authentication/identification; Multimedia Forensics;

SPIE - The international society for optics and photonics

SPIE Advanced Lithography + Patterning is the leading global lithography event. Attend the meeting for optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent applications. Hear the latest advancements where leaders come to solve challenges in lithography, patterning technologies, and materials for the semiconductor industry. SPIE Advanced Lithography + Patterning draws more than 2,000 attendees, 50 exhibitors, and 500 technical papers representing the most talented researchers and managers working in the lithography industry. Leading experts offer courses that will keep you and your team current.

Customer Service;     Phone: [+1 360 676 3290];     Email: customerservice@spie.org

Lithography, Semiconductors, Metrology, Semiconductor, Patterning, Etch, Optical Lithography, EUV, EUVL

Semiconductors,    Microtechnology, Nanotechnology

Hosted by the University of Ulm in cooperation with IMA e.V. and VDE/ITG.

The 14th German Microwave Conference 2022, GeMiC 2022, provides a unique platform of exchange with experts and to meet colleagues from industry, research institutes, and universities.

APEC is the leading conference for practicing power electronics professionals and addresses a broad range of topics in the use, design, manufacture and marketing of all kinds of power electronics equipment.

International Association of Computer Science and Information Technology

We are pleased to announce that The 5th International Conference on Electronics, Communications and Control Engineering (ICECC 2022) will be held at Fukuoka Institute of Technology, Japan during March 25-27, 2022. ICECC is an annual conference launched in the year of 2018. We had this conference successfully held at Avid College, Maldives in 2018, in Phuket, Thailand in 2019, online (due to COVID-19) in 2020 and 2021.

Phone: [+86-18302820449];     Email: aimee@iacsit.net

3D Process and Integration Technologies; Substrate Embedding & Advanced Flip-Chip Packaging; MEMS & Sensor Technologies; Wafer-Level CSP & Heterogeneous Integration; Design and Analysis of Power Delivery Systems; Novel Materials, Devices and 3D Interconnects; Wearable, Flexible, and Stretchable Electronics; Optical Interconnects & 3D Photonics; Digital System and Logic Design; Computer Architecture and VLSI; Networked-Driven Multicore Chips; Advance Robotics Systems; Electrical Machines; Analog and Digital Electronics; Signals and Systems;

YOUNG

We would like to invite you to participate in 2022 9th International Conference on Electrical and Electronics Engineering (ICEEE 2022), which will be held in Alanya, Turkey during March 29-31, 2022. It's supported by Gazi University, Turkey and IEEE Turkey Section.

Email: saraxc17@163.com

Power Generation, Transmission and Distribution, Renewable Energy Sources, Smartgrids Technologies & Applications, Power Electronics, Systems and Applications, Electrical Machines and Adjustable Speed Drives

The South Asia Institute of Science and Engineering

2022 9th International Conference on Mechatronics, Electronics and Automation Engineering (ICMEAE 2022) will be held in Beijing, China during April 15-17, 2022. ICMEAE 2014 was successfully held in Lijiang, China, ICMEAE 2015 was successfully held in Bangkok, Thailand, ICMEAE 2016 was successfully held in Singapore, ICMEAE 2017 was successfully held in Chulalongkorn University, Thailand, ICMEAE 2018 was successfully held in Nagoya Institute of Technology, Japan and ICMEAE 2019 was successfully held in Southeast University, China.

Phone: [+86-18215525193];     Email: brandon@saise.org

Actuator design, robotic mechanisms and design, robot kinematics and dynamics; Agile Manufacturing; Agriculture, construction, industrial automation, manufacturing process Automation and control systems, middleware; Biomedical and rehabilitation engineering, welfare robotics and mechatronics; Cellular Manufacturing; Concurrent Engineering; Design for Manufacture and Assembly; Distributed Control Systems; Flexible Manufacturing Systems; Humanoid robots, service robots; Human-robot interaction, semi-autonomous systems, telerobotics; Knowledge Based Systems; Lean Manufacturing Logistics; Management of Technology ;

The world's premier EDA and semiconductor design conference and exhibition. DAC features over 60 sessions on design methodologies and EDA tool developments, keynotes, panels, plus the NEW User Track presentations. A diverse worldwide community representing more than 1,000 organizations attends each year, from system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities.

American Automatic Control Council (AACC)

The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).

Robotics, Automation & Mechatronics,    Mechanical engineering

Passive Components represent more than 80% of the EEE parts used in spacecraft. Therefore, they represent a major concern for space applications. In recent years, the development of Passive Components has been driven by reliability, performances, new functionalities, mass and volume saving and cost reduction. Space Passive Component Days (SPCD) international Symposium The SPCD international Symposium is the premier technical conference dedicated to Passive components for space applications. It is an exceptional venue to learn more about the latest advances in this field and meet recognized experts from industry, academia and agencies.

Engineering (general),    Electrical Engineering

IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

APEC is the leading conference for practicing power electronics professionals and addresses a broad range of topics in the use, design, manufacture and marketing of all kinds of power electronics equipment.

American Automatic Control Council (AACC)

The American Control Conference (ACC) is an annual 3-day meeting that brings together an international community of researchers and practitioners in all areas related to the engineering and science of control systems. The ACC is held under the auspices of American Automatic Control Council (AACC), the US National Member Organization of the International Federation of Automatic Control (IFAC).

Robotics, Automation & Mechatronics,    Mechanical engineering

IEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

APEC is the leading conference for practicing power electronics professionals and addresses a broad range of topics in the use, design, manufacture and marketing of all kinds of power electronics equipment.

APEC is the leading conference for practicing power electronics professionals and addresses a broad range of topics in the use, design, manufacture and marketing of all kinds of power electronics equipment.