Conferences  >  Informatics  >  Computing Hardware

Abdus Salam International Centre for Theoretical Physics (ICTP), Trieste, Italy

Electronic Engineering,    Software Engineering

Hong Kong Printed Circuit Association (HKPCA)

Themed "AI Powers the Future", the International Electronic Circuit (Shenzhen) Exhibition is one of the most influential PCB and electronic assembly exhibitions in the world.

Visitor Inquiry;     Phone: [(86-20) 3758-3765 ext. 8008];     Email: pr@hkpcashow.org

Printed Circuit Boards, Automotive, Electronics, Communication, Smart Automation, Electronic Assembly, AI, 5G, Semiconductors

Internet of Things (IoT) and Sensor Networks,    Electronic Engineering

Kalasalingam Academy of Research and Education, Department of Electronics and Communication Engineering

International Conference on Sustainable Materials and Technologies in VLSI and Information Processing (SMTVIP, 2024) will be organized by Department of Electronics and Communication Engineering, Kalasalingam Academy of Research and Education, Krishnankoil, Tamil Nadu, India on 13th - 14th December 2024. SMTVIP is an annual event that aims to bring Academia, researchers, engineers, students and industry professionals to share the latest developments and advancements in the field. The conference covers a wide range of topics related to VLSI design, signal processing, and information processing, including but not limited to: VLSI design, Embedded and IoT, Signal and Information Processing, Communication, Networking. The conference provides a platform to share their latest research findings and exchange ideas on emerging trends, technologies, and collaborate on new projects. It also provides an opportunity for attendees to establish new partnerships with peers in their respective fields. Original, previously unpublished and high-quality research papers would be appreciated. All submitted articles must not be under consideration for publication elsewhere. All accepted, presented and registered papers under this conference will be published by CRC press (Taylor and Francis Group) to be indexed with Scopus.

Organizer;     Email: smtvip@klu.ac.in

Advanced Process / Materials in VLSI Devices, VLSI design techniques and methodologies, Analog and digital circuit design, Low-power design, FPGA design and implementation, Analog/Mixed-Signal Design, Synthesis and Optimization, Design & Modelling, Networking Technologies and Protocols, Real Time Systems, Human-Computer Interaction for IoT Devices, Wireless sensor networks, Signal processing algorithms and architectures, Image and video processing, Audio and speech processing, Biomedical signal processing, Machine learning and Deep Learning, Pattern Recognition, Sensor signal processing, Cellular 5G/6GCommunication, Digital Communication, Photonics and Cloud computing, Wireless Networking, Social Networking, Network Applications and Services,

ASP-DAC is the largest conference in Asia and South-Pacific regions on Electronic Design Automation (EDA) area for VLSI and systems. ASP-DAC has been started at 1995 and this ASP-DAC 2025 is 30th conference. ASP-DAC 2025 offers you an ideal opportunity to touch the recent technologies and the future directions on the LSI design and design automation areas by technical papers and tutorials. ASP-DAC also holds Designers' Forum to make presentations about the latest designs for designers.

Microtechnology, Nanotechnology,    Electronic Engineering

SPIE – The International Society for Optics and Photonics

Experience the energy of SPIE AR | VR | MR by sharing your work. The focus on hardware and enabled content, combined with visionary industry perspectives from technology leaders working in the largest XR companies, startups, and suppliers, makes this an event to include in your calendar every year.

The premier event for AR, VR and MR hardware development

Photonics, Optoelectronics and Display Devices,    Human-Computer Interaction, User Experience, Virtual Reality

IEEE

The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts

Schloss Dagstuhl - Leibniz-Zentrum für Informatik GmbH

"The world is flat and rectangular", at least when it comes to the types of physical screens that we use for representing data and making decisions. The physical screens that we consider when creating visualizations for representing data, making decisions with this data, and learning about our environment, are predominantly flat and rectangular: our mobile phones and tablets, desktops, or even large wall or table displays. Nevertheless, technology is already evolving quickly: curved, bendable, and highly flexible displays, spherical displays, cubed displays, and even drone-based displays have emerged and are commercially available. These novel types of displays offer new ways to represent and explore data embedded in everyday environments, to communicate and share it.

Multimedia, Computer Graphics and Visualization, Games,    Human-Computer Interaction, User Experience, Virtual Reality

Optica

Join our online industry meeting on Photonic Integrated Circuits (PICs) packaging for volume manufacturing. This event gathers industry leaders to discuss transformations in PIC packaging to meet mass manufacturing demands, similar to CMOS microelectronics. We will explore strategies for high throughput and yield, essential in today's tech landscape. The meeting will tackle challenges in PIC assembly, such as precision alignment, thermal management, and co-packaging with electronic components. We will also discuss the shift towards wafer-level processes required for increased production volumes, encouraging collaboration and innovative solutions for mainstream volume PIC manufacturing.

Microtechnology, Nanotechnology,    Engineering & Industry (general)

USENIX Association

Schloss Dagstuhl - Leibniz-Zentrum für Informatik GmbH

Memory is a central component in every computer system. The technological evolution has led to greater capacities and higher speeds, but essential properties of the interface between hardware and software have been unchanged for decades: Main memories were usually passive, largely homogeneous, and volatile. These properties are now so firmly anchored in the expectations of software developers that they manifest in their products.

The Texas Symposium on Wireless and Microwave Circuits and Systems conference will be held on April 9-10, 2025, at the Baylor Research and Innovation Collaborative (BRIC) building on the campus of Baylor University in Waco, TX.

Optica

Join us for the OPTICA Online Industry Meeting on Co-packaged and Linear Drive Optics, where experts will explore advancements in photonic-enabled AI applications. This event will highlight innovations in integrating optics with AI hardware, enhancing processing speeds and efficiency in data-intensive tasks. Discussions will address current challenges such as optimizing power consumption, achieving high-speed data transfer, and ensuring compatibility with existing AI architectures.

Photonics, Optoelectronics and Display Devices,    Implementation and Applications of Artificial Intelligence

optoelectronic components and devices, optical systems, optical interconnects, transmission, and networking

Photonics, Optoelectronics and Display Devices,    Electronic Engineering

Optica

Join us for the OPTICA Online Industry Meeting on Photonic-enabled AI, where experts will delve into the intersection of photonics and artificial intelligence (AI). This event will explore how photonics technologies are revolutionizing AI applications by enhancing processing speed, energy efficiency, and scalability. Discussions will address current challenges such as integrating photonics with AI hardware, optimizing photonic components for AI algorithms, and overcoming limitations in data throughput and processing latency. The meeting will also highlight opportunities for leveraging photonic-enabled AI, including advancements in neuromorphic computing, optical processing units (OPUs), and photonic co-processors. These technologies promise to unlock new capabilities in machine learning, pattern recognition, and complex data analysis. Engage with industry leaders to explore innovative solutions and collaborations that drive the future of AI-powered by photonics, paving the way for next-generation computing and intelligent systems.

Photonics, Optoelectronics and Display Devices,    Implementation and Applications of Artificial Intelligence

Electronic Engineering,    Trade Shows and Exhibitions

IEEE

The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts