Conferences  >  Engineering  >  Electronic Engineering  >  Germany

ECV International

This summit centered on the theme "E/E Architecture Innovation in the Age of AI and SDV", will bring together leading global OEMs, Tier 1 suppliers, technology giants, and academic pioneers to explore how next-generation E/E architecture is shaping the foundation of intelligent vehicles; and discuss how AI acts as a central driving force, guiding the next revolution in E/E architecture across computing, communication, power distribution, and hardware-software integration—laying a solid foundation for building more efficient, intelligent, and secure future vehicles.

European Automotive E/E System Summit 2026;     Phone: [8613271915990];     Email: britney@ecvinternational.com

Driving Software-Centric Innovation: What’s Next for E/E Architecture From Distributed to Centralized: Architecting the Future of E/E Systems with AI The AI-Driven Automotive Revolution: From Centralized Computing to Autonomous Mobility Unlocking Central Compute Performance: How High-Speed In-Vehicle Networks Power AI-Defined Vehicle Next-Generation E/E Architectures: Scalability, AI Integration & Multi-Path Electrification Towards Gigabit Ethernet in SDV: OEM Challenges in Scaling Bandwidth, Safety and Real-Time Communication Sensor Fusion Architecture: Delivering High-Quality Data for AI Designing the Data Backbone: High-Speed In-Vehicle Networks in Centralized Vehicle Architectures Road to Cloud Mobility: Cross- Domain E/E Architecture Powering in SDV Era Securing SDV: From Embedded Security to Secure Boot and Partitioning

Electrical Engineering,    Automotive Engineering, Roads and Railways