Meetings/Workshops on Microtechnology, Nanotechnology in Japan
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LTB-3D 2019 — 6th International Workshop on Low Temperature Bonding for 3D Integration
21 May 2019 - 25 May 2019 • Kanazawa, Ishikawa-prefecture, Japan
This workshop is focusing on the promotion of advanced research areas related to low-temperature bonding technologies, including surface activated bonding (SAB), which realize novel device structure by heterogeneous material and device integration and lead to entirely new manufacturing approaches to 3D and module integration of semiconductor devices, photonics systems, and power electronic systems.
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Last updated: 28 January 2019