Meetings/Workshops on Plastics, Paints and Synthetic Materials in the United States (USA)

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InterPACK 2021 — International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
26 Oct 2021 - 28 Oct 2021 • Online, United States
Organizer:
The American Society of Mechanical Engineers (ASME)
Abstract:
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD).
Topics:
InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid and Electric Vehicles.
Event listing ID:
1402077


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Last updated: 14 January 2021